Advanced Welding and Micro Joining / Packaging for the 21st Century
Materials Science Forum Volumes 580 - 582
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p167
Study on Induction Spontaneous Heating Reflow
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503 K
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Authors: Hong Bo Xu, Ming Yu Li, Jong Myung Kim, Hong Bae Kim, Dae Won Kim -
p173
Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-Off Method
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1 M
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Authors: Hee Seon Bang, Hong Jun Ji, Ming Yu Li, Chun Qing Wang, Han Sur Bang -
p177
Bending Fatigue Characteristic of Sn-3.5Ag Solder Bump on Ni-UBM
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707 K
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Authors: K.I. Kang, J.P. Jung, Woong Ho Bang, J.H. Park, Kyu Hwan Oh -
p183
Reproducing the Shilla Dynasty’s Direct-Bonding Granulation Process
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1 M
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Authors: Oh Sung Song, Jong Ryul Kim, Myung Ro Kim -
p191
Effect of Laser Parameter on the Bond Characteristics of Sn-3.5%Ag Solder Ball
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757 K
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Authors: Jeng O Kim, Jae Pil Jung, Jae Hoon Lee, Jeong Suh, Hee Shin Kang -
p197
Characterization of Contact Formation Process for High Efficiency Solar Cell Using Design of Experiment (DOE)
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741 K
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Authors: Sung J. Lee, Sei Young Moon, Se. W. Jung, Seung Soo Han, Sang Jeen Hong -
p201
Tail Breaking Force in Thermosonic Wire Bonding with Novel Bonding Wires
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171 K
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Authors: J. Lee, Michael Mayer, Y. Zhou, S.J. Hong, S.M. Lee -
p205
High Dissolution Rate of Solid Materials in Molten Lead-Free Solders
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558 K
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Authors: Tadashi Takemoto -
p209
Micromechanical Responses of Sn-3.5Ag-xCo Lead-Free Solders by Nanoindentation
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10 M
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Authors: Feng Gao, Hiroshi Nishikawa, Tadashi Takemoto -
p213
Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)
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726 K
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Authors: Seong Hyuk Lee, Jung Hee Lee, Jin Woon Lee, Jong Min Kim
