Advanced Welding and Micro Joining / Packaging for the 21st Century
Materials Science Forum Volumes 580 - 582
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p217
An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)
[
403 K
]
Authors: Jong Min Kim, K.C. Yang, S.B. Lee, Seong Hyuk Lee, Young Eui Shin, Kyong Ho Chang, J.G. Han, Y.S. Eom, J.T. Moon, J.W. Baek, Jae Do Nam -
p221
Estimation of Thermal Fatigue Resistance of Sn-Bi (-Ag) and Sn-Ag-Bi-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
[
727 K
]
Authors: Kiyokazu Yasuda, Ikuo Shohji, Tadashi Takemoto -
p225
Small-Scale Resistance Welding of Crossed TiNi Fine Wire
[
5 M
]
Authors: Shinji Fukumoto, Shigeru Morikawa, Atsushi Yamamoto -
p229
Characteristic of Electrochemical Migration
on Flexible Printed Circuit Board
[
600 K
]
Authors: Bo In Noh, Jong Bum Lee, Bo Young Lee, Seung Boo Jung -
p233
Analysis of Solder Fatigue in Electronic Packaging Using a Mesh-Insensitive Structural Stress Method
[
574 K
]
Authors: Jeong K. Hong, Ping Sha Dong -
p239
Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder
[
3 M
]
Authors: Fang Jie Cheng, Hiroshi Nishikawa, Tadashi Takemoto -
p243
Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder
[
965 K
]
Authors: Hiroshi Nishikawa, Akira Komatsu, Tadashi Takemoto -
p247
Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test
[
1 M
]
Authors: S.W. Han, Kyong Ho Chang, J.G. Han, Il Je Cho, Jong Min Kim, M.G. Choi, Y.T. Kim, Young Eui Shin -
p251
Design of a Control System for Welding Robot with Tracking Simulation
[
255 K
]
Authors: Jin Seok Oh, Jong Do Kim, Jun Ho Kwak, Ji Young Lee -
p259
Reliability Assessment of Lead Free Soldered PWBs
[
1 M
]
Authors: Il Je Cho, Kyu Sang Chae, Soon Tae Kim, Olaf Wittler, Young Eui Shin
