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Preparation and Properties of Silicon Nitride Ceramics by Nitrided Pressureless Sintering (NPS) Process

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Abstract:

Silicon nitride ceramics were prepared by new nitrided pressureless sintering (NPS) process in this study. The microstructures, strengths and thermal properties of the NPS silicon nitride ceramics containing three types of Al2O3 and Y2O3 sintering additives were investigated. Additionally, we have investigated the effect of silicon metal contents changing with 0, 5, 10, 15 and 20 wt% in each composition. The silicon nitride was successfully densified using NPS process, particularly at the starting composition of 5 wt.% Al2O3, 5 wt.% Y2O3, and 5 wt.% Si addition. The maximum flexural strengths and relative densities of these specimens were 500 MPa and 98%, respectively. The flexural strength of sintered specimens after the thermal shock test between 30oC and 1300oC for 20,000 cycles was maintained with the original laboratory strength of 500MPa by low thermal expansion coefficient, 2.9 × 10-6/oC, and high thermal conductivity, 28 W/m⋅oC.

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Periodical:

Key Engineering Materials (Volumes 317-318)

Pages:

125-130

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.317-318.125

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Online since:

August 2006

Authors:

In Sub Han, Seung Ho Cheon, Yong Hee Chung, Doo Won Seo, Shi Woo Lee, Sang Kuk Woo, Kee Sung Lee

Keywords:

Nitrided Pressureless Sintering, Thermal Shock Resistance

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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