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Advances in Abrasive Technology IX

Key Engineering Materials Volume 329

• Papers
• Abstracts

• p309 High Speed Lapping Ellipsoid by Means of a Lapping Tool Bending Method   [ 324 K ]
  Authors: J.D. Yang, Q. Liu, C.L. Tian, J.W. Guo, Y.H. Feng
• p315 Study on Mechanism and Experiment of Engine Cylinder by Laser Honing   [ 439 K ]
  Authors: Yong Kang Zhang, De Jun Kong, Y.H. Fu, Jin Zhon Lu, Ai Xin Feng, Xu Dong Ren
• p323 Cost Optimization of Abrasive Blasting Systems: A New and Effective Way for Using Blasting Nozzles   [ 178 K ]
  Authors: Vu Ngoc Pi, A.M. Hoogstrate
• p329 Three-Dimensional Simulation of Liquid-Solid Two-Phase Flow Inside the Abrasive Water Jet Nozzle   [ 241 K ]
  Authors: Chuan Zhen Huang, Rong Guo Hou, Jun Wang, X.Y. Lu, Hong Tao Zhu
• p335 Surface Characteristics of Ceramics Milled with Abrasive Waterjet Technology   [ 147 K ]
  Authors: Yan Xia Feng, Chuan Zhen Huang, Jun Wang, X.Y. Lu, Hong Tao Zhu
• p341 Fusion Identification for Wear Particles Based on Dempster-Shafter Evidential Reasoning and Back-Propagation Neural Network   [ 465 K ]
  Authors: Y.B. Cao, X.P. Xie
• p347 Design of Robust Grinding Wheel Reciprocating Arrangement for Precision Point-Grinding Machining   [ 404 K ]
  Authors: Da Ping Wan, De Jin Hu, Li Ming Xu, Hai Feng Wang, X.D. Yao
• p353 Improvement of Surface Texture of Stainless Steel by Utilizing Dry Blasting - 3rd Report: Effect of Blasted Texture on Adhesion of Plating -   [ 636 K ]
  Authors: Kazushi Minaki, Koichi Kitajima, Yu Nakahira, K. Minaki, Moriyasu Izawa, K. Tosha
• p361 Experimental Investigations of Silicon Wafer Grinding   [ 1 M ]
  Authors: J.H. Liu, Zhi Jian Pei, Graham R. Fisher
• p367 Microstructural Analysis for Si Wafer after CMG Process   [ 1 M ]
  Authors: Sumio Kamiya, Hisao Iwase, Tetsuya Nagaike, Li Bo Zhou, Hiroshi Eda, Shun-ichiro Kimura