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Advances in Abrasive Technology IX

Key Engineering Materials Volume 329

• Papers
• Abstracts

• p373 Study on Structure Transformation of Si Wafer in Grinding Process   [ 3 M ]
  Authors: Li Bo Zhou, Makoto Yamaguchi, Jun Shimizu, Hiroshi Eda
• p379 Experimental and Simulation Research on Influence of Temperature on Nano-Scratching Process of Silicon Wafer   [ 936 K ]
  Authors: H. Okabe, T. Tsumura, Jun Shimizu, Li Bo Zhou, Hiroshi Eda
• p385 A Study on Deformation and Removal Mechanisms of Tungsten Carbide Using Nanoindentation   [ 491 K ]
  Authors: Han Huang, R. Irwan, Tsunemoto Kuriyagawa
• p391 Material Removal Mechanisms Involved in Rotary Ultrasonic Machining of Brittle Materials   [ 8 M ]
  Authors: Choung Lii Chao, Wen Chen Chou, Chung Woei Chao, Chao Chang A. Chen
• p397 Numerical Simulation and Prediction of Surface Heterogeneity in Diamond Turning of Single-Crystalline Germanium   [ 1 M ]
  Authors: Ji Wang Yan, Yu Feng Fan, Nobuhito Yoshihara, Tsunemoto Kuriyagawa, Shoji Yokoyama
• p403 A Finite Element Analysis of Stress Fields in Vickers Indentation on Brittle Materials   [ 765 K ]
  Authors: Bing Zhang, Masato Yoshioka
• p409 Critical Cutting Condition for Brittle-Ductile Transition of KDP Crystals in Ultra-Precision Machining   [ 626 K ]
  Authors: Jing He Wang, Ming Jun Chen, Shen Dong, H.X. Wang, J.H. Zhang, Wen Jun Zong
• p415 Nano-Structures Fabrication by Laser Combined with Near-Field Scanning Optical Microscopy   [ 280 K ]
  Authors: Dong Jiang Wu, Juan Zhuang, Xu Yue Wang, Ren Ke Kang, Fu Ling Zhao
• p421 Ceramic Grindability Evaluation with PCA Method   [ 166 K ]
  Authors: Ai Bing Yu, Yao Chen, Da Wei Jia, Xin Li Tian
• p427 Analysis of Mechanical Property of Crystal KDP and Simulation of Ultra-Precision Cutting Process in the Ductile Mode   [ 1004 K ]
  Authors: Ming Jun Chen, Jing He Wang, X.M. Chen, Ying Chun Liang