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Analysis of Stress Distribution in SnAgCu Solder Joint

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Abstract:

SnAgCu solder is a promising lead-free material for interconnections in electronic packages. However, its melting temperature (490°K) is considerably higher than that of the traditional SnPb solder (456°K). At the same time, SnAgCu has much better creep resistance at high temperature. These properties may cause large residual stresses during manufacturing processes due to the mismatch of thermal properties of electronic components that can influence the reliability of solder joints in electronic packages. This paper studies the residual stresses in solder joints in a flip chip package under different cooling conditions and their influence on the subsequent cyclic test by means of a finite element approach. The results show that the initial temperature of 453°K is high enough to induce residual stresses due to manufacturing procedures. Simulations, based on traditional creep-fatigue models, demonstrate that the residual stresses affect the mechanical behaviour of solder joints in several initial thermal cycles but have little effect on their reliability.

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Info:

Periodical:

Applied Mechanics and Materials (Volumes 5-6)

Pages:

359-366

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.5-6.359

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Cite this paper

Online since:

October 2006

Authors:

J. Gong, C. Liu, Paul P. Conway, Vadim V. Silberschmidt

Keywords:

Finite Element, Flip Chip, Lead-Free SnAgCu Solder, Stress

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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References

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