Characterization Methodology of the Interface in Multilayer Composites

H.C. Yeo; N. Guo; Weimin Huang; H. Du; X.M. Jian

doi:10.4028/www.scientific.net/KEM.334-335.1041

Paper Titles

SiO₂ (core)-TiO₂ (shell) Structure as Catalyst Support for Oxidation of CO at Low Temperatures
p.1025

Preparation and Characterization of TiO₂/4A Zeolite Composites
p.1029

Optimal Placement of Sensors for Damage Characterization Using Genetic Algorithms
p.1033

Spark Plasma Sintering of Core-Shell Structured (Mg,Zn)O Wrapped Ba_1-xSr_xTiO₃ Nanopowder
p.1037

Characterization Methodology of the Interface in Multilayer Composites
p.1041

Fabrication of C_f/SiC Composites by Hot-Pressing
p.1045

Perovskite Relaxor Ferroelectric Thick Films Directly Grown from Oxide Precursors by a Low Temperature Hydrothermal Process
p.1049

Dielectric Properties of AlN/Polymer Composites for Electronic Substrate Application
p.1053

The Effect of Mechanical Property on the Erosive Behaviour of NiTi SMAs
p.1057

HomeKey Engineering MaterialsKey Engineering Materials Vols. 334-335Characterization Methodology of the Interface in...

Characterization Methodology of the Interface in Multilayer Composites

Abstract:

The quality of the interfaces in multilayer composites is a critical issue in the reliability testing of the composite product during the manufacturing process and in-service. Weak interfaces have often gone undetected and may become potentially defective at a later stage. One example is the interface between mold compound and silicon (MC/Si) in IC packaging. There is a desire to study the interface quality quantitatively, so the potential defective area can be evaluated and identified early. In this paper, a nondestructive evaluation methodology is proposed to measure the available strength of the interface by using ultrasonic reflection coefficients. It is known that interface degradation can be either due to poor manufacturing process and stress loading. Characterization of the interface quality of the MC/Si interface is first conducted by measuring longitudinal ultrasonic wave reflections from the interface samples fabricated under varying conditioning processes that simulate the degradation. A combined test that measures the reflection coefficient of the interface under stress load has also been conducted to quantify the effect of the load. Finally, it is shown that the overall effect on the reflection coefficient and available strength of the interface is derived and can be used as a quantitative indicator.