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Microstructures of Rapidly Solidified Pb-Sb-Sn-Alloys
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Effect of Technological Parameters on the Profile Extrusion Process
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Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing
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Crystal-Grain Refinement of Materials under an Ultra-Strong Gravitational Field
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On the Physical Meaning of the Hall-Petch Constant
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Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

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Abstract:

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

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Info:

Periodical:

Advanced Materials Research (Volumes 15-17)

Pages:

633-638

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.15-17.633

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Online since:

February 2006

Authors:

Jong Woong Kim, Hyun Suk Chun, Sang Su Ha, Jong Hyuck Chae, Jin Ho Joo, Young Eui Shin, Seung Boo Jung

Keywords:

Board Level, Pb-Free Solder, Reliability, Sn-3.0Ag-0.5Cu, Thermal Shock

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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