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Progress of Precision Engineering and Nano Technology

Key Engineering Materials Volume 339

• Papers
• Abstracts

• p234 The Mechanism and Feasibility of Self-Assembly with Capillary Force   [ 319 K ]
  Authors: D.P. Zhao, D. Wu, K. Chen
• p240 Study on Displacement Self-Sensing of Piezoelectric Actuator   [ 144 K ]
  Authors: Y.G. Cui, W.J. Dong, C.Y. Gao, Q.Y. Zeng, B.Y. Sun
• p246 Design and Fabrication of Micro Hot Embossing Mold for Microfluidic Chip Used in Flow Cytometry   [ 264 K ]
  Authors: L.Q. Du, C. Liu, H.J. Liu, J. Qin, N. Li, Rui Yang
• p252 Research on Flow in Microchannels with Lotus Effect Coating by Molecular Dynamics Simulation   [ 248 K ]
  Authors: K. Jia, H.H. Zhang, X.Q. Fan, X.P. Jiang, S. Liu
• p257 Features of Machine Variables in Thermosonic Flip Chip   [ 502 K ]
  Authors: Jun Hui Li, Lei Han, Ji An Duan, Jue Zhong
• p263 Applications of Polishing Technology Using Polymer Particles to Silicon Wafers and Quartz Crystal Wafers   [ 323 K ]
  Authors: Y.S. Lu, Yasuhiro Tani, K. Soutome, Y. Kamimura
• p269 Dynamic Modeling of Predicting Chip Formation Based on Artificial Neural Networks and Real-Time Simulation of Chip   [ 186 K ]
  Authors: Wen Jin Wang, Tai Yong Wang, S.B. Fan, W.Y. Wang, G.F. Wang, W. Zhang
• p276 Effects of Imperfections on Bifurcation of Multi-Layer Microstructures of MEMS under Thermal Loading   [ 322 K ]
  Authors: Y.T. Yu, Wei Zheng Yuan, D.Y. Qiao
• p281 High Speed Wire Electrical Discharge Machining (HS-WEDM) Phenomena of Insulating Si₃N₄ Ceramics with Assisting Electrode   [ 198 K ]
  Authors: Yong Feng Guo, Ji Cheng Bai, Guan Qun Deng, Ze Sheng Lu
• p286 A Study of Micro V-Groove Fabrication in Ultra-Precision Freeform Machining   [ 560 K ]
  Authors: Sandy To, Chi Fai Cheung, Su Juan Wang, Wing Bun Lee