Paper Titles
Microstructure and High Temperature Mechanical Properties of Inconel 617
p.411
Microstructure and Mechanical Properties of Si3N4/hBN Composites Prepared by Hot-Pressing Using Nitrided Si3N4 Powders
p.415
Noncombustible Magnesium Alloy Processed by Rotary-Die Equal Channel Angular Pressing Method
p.419
Passive-Active Transition Behavior of 304 Stainless Steel
p.423
Prediction of Temperature Distribution during Curing Thick Thermoset Composite Laminates
p.427
Processing and Properties of Al Based Amorphous/Crystalline Alloy Composites
p.431
Processing, Microstructure and Mechanical Properties of Hybrid Materials with Al-Mg Alloy and its Composites
p.435
Product Geometry for Process Parameter during Rotary Swaging Process as Chipless Forming Process
p.439
Recycling of 6061 Aluminum Alloy Cutting Chips Using Hot Extrusion and Hot Rolling
p.443

Prediction of Temperature Distribution during Curing Thick Thermoset Composite Laminates

Article Preview

Abstract:

A 3-D transient heat transfer finite element (FE) analysis was performed to simulate the curing process of thick thermoset composites. The simulated temperature was compared with the available experimental data to check the validity of the analysis. The influence of thickness of composite laminates on the temperature distribution was investigated, and how the size of laminates affects the inside temperature was also discussed. The results indicate that the laminate thickness rather than the laminate size has a significant influence on temperature distribution, and the 3-D analysis offers more accurate predictions than the 1-D analysis.

You might also be interested in these eBooks
Eco-Materials Processing and Design VIII View Preview

Info:

Periodical:

Materials Science Forum (Volumes 544-545)

Pages:

427-430

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.544-545.427

Citation:

Cite this paper

Online since:

May 2007

Authors:

Je Hoon Oh

Keywords:

Cure Simulation, Exothermic Reaction, Temperature Overshoot, Thick Composites

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2007 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] G.M. Martinez: Chem. Eng. Sci. Vol. 46 (1991), p.439.

Google Scholar

[2] S.R. White and Y.K. Kim: Composites Part A Vol. 27 (1996), p.219.

Google Scholar

[3] D.J. Michaud, A.N. Beris and P.S. Dhurjati: J. Comp. Mater. Vol. 32 (1998), p.1273.

Google Scholar

[4] S.C. Joshi, X.L. Liu and Y.C. Lam: Comp. Sci. and Tech. Vol. 59 (1999), p.1003.

Google Scholar

[5] J.S. Kim and D.G. Lee: J. Comp. Mater. Vol. 31 (1997), p.2264.

Google Scholar

[6] J.H. Oh and D.G. Lee: J. Comp. Mater. Vol. 36 (2002), p.19.

Google Scholar

[7] L. Chiao and R.E. Lyon: J. Comp. Mater. Vol. 24 (1990), p.739.

Google Scholar

[8] S.T. Peters, in: Handbook of Composites - 2nd Ed., part 1, Chapman and Hall (1998).

Google Scholar