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Progress in Light Metals, Aerospace Materials and Superconductors

Materials Science Forum Volumes 546 - 549

• Papers
• Abstracts

• p2279 Preparation of Green Tapes for LTCC/Cu Multilayer Substrates   [ 16 M ]
  Authors: Yan Wang, Yang Liu, Ju Sheng Ma
• p2283 Fabrication of Mo/Cu Functional Graded Material by Resistance Sintering under Ultra-High Pressure   [ 307 K ]
  Authors: Juan Du, Zhang Jian Zhou, Shu Xiang Song, Zhi Hong Zhong, Chang Chun Ge
• p2287 Effect of Tin Additive on the Microstructure and Loss of Ferrite for Switching Mode Power Supply   [ 20 M ]
  Authors: Ke Sun, Zhong Wen Lan, Zhong Yu
• p2293 A New Bulk Deformation Method – Cyclic Extrusion   [ 6 M ]
  Authors: J. Zhang
• p2301 Temperature Measurement and Microstructure Control for Rene88DT Superalloy during Laser Rapid Forming   [ 1 M ]
  Authors: Hua Tan, Jing Chen, Xin Lin, Xiao Ming Zhao, Wei Dong Huang
• p2307 The Dispersion of MWCNTs within Epoxy by Treatment with Coupling and Dispersing Agents   [ 1 M ]
  Authors: Yan Zhao, Yue Xin Duan
• p2313 Hot Corrosion Behavior of AlCuFeCr Quasicrystalline Coating on Titanium Alloy with the Mixture of NaCl and Na₂SO₄ Deposit   [ 676 K ]
  Authors: Feng Feng Wang, Chun Gen Zhou, Sheng Kai Gong, Hui Bin Xu