Deformation and Heat Treatment of Cold Drawn Gold

Article Preview

Abstract:

Cold drawn gold wires are widely applied in electronic packaging process to interconnect micro-electronic components. They basically provides a conducting path for electronic signal transfer, and experience thermo-mechanical loads in use. The mechanical stability of drawn gold wires is a matter of practical concern in the reliable functioning of electronic devices. It is known that mechanical properties of materials are deeply related to the microstructure. With appropriate control of deformation and heat processes, the mechanical properties of final products, such as tensile strength and elongation can be improved. Severe plastic deformation by torsion usually contributes to grain refinement and increment of strength. In this study, microstructure variations with torsion strain followed by drawing and heat treatment were investigated. Analyses by focused ion beam (FIB) and electron backscattered diffraction (EBSD) were carried out to characterize the effect of deformation and heat treatment on the drawn gold wires. Pattern quality of EBSD measurements was used as a quantitative measure for plastic deformation.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

289-294

Citation:

Online since:

July 2007

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2007 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] S. H Kang, H. S. Jung, W. H. Bang, J. H. Cho, K. H. Oh, D. S. Kim, J. S. Cho, Y. J. Park, S. H. Park : Materials Science Forum, Vols. 495-497 (2005), p.907.

DOI: 10.4028/www.scientific.net/msf.495-497.907

Google Scholar

[2] Jae-Hyung Cho, J. -S. Cho, J. -T. Moon, J. Lee, Y.H. Cho, Y.W. Kim, A.D. Rollett and K.H. Oh : Metall. Mater. Trans A, Vol 34A (2003), p.1113.

Google Scholar

[3] Jae-Hyung Cho, A.D. Rollett, J.S. Cho, J.T. Moon, Y. -J. Park, Y.H. Cho, A.D. Rollett and K.H. Oh : Metall. Mater. Trans A, Vol 37A (2006), at press.

Google Scholar

[4] Stuart I. Wright and Matthew M. Nowell : Microsc. Microanal., Vol. 12 (2006) p.72.

Google Scholar

[5] David C. Joy, Dale E. Newbury, David L. Davidson : J. Appl. Phys., Vol. 53 (1982) p.81.

Google Scholar

[6] Wilkinson, A. J. : Ultramicroscopy., Vol 62 (1996) p.237.

Google Scholar

[7] Wilkinson, A. J. Dingley, D.J., : Acta Metall. Mater., Vol 39 (1991) p.3047.

Google Scholar

[8] Krieger Lassen, N.C., Juul Jensen, D. m and Conradsen, K., : Mater. Sci. Forum,. Vol. 157-162 (1994) p.149.

Google Scholar

[9] Kunze, K., Wright, S.I., Adams, B.L. & Dingley, D.J. : Texture Microstruct Vol. 20 (1993), p.41.

Google Scholar

[10] S.R. Claves and A. Deal, : Microsc Microanal Vol. 11 (2005), p.514.

Google Scholar

[11] Jae-Hyung Cho, H. -P. Ha, and Kyu Hwan Oh : Metallurgical and Materials Transactions Vol. 36A, (2005) p.3415.

Google Scholar