Paper Titles
In-Situ EBSD Observation of the Recrystallization of an IF Steel at High Temperature
p.441
Temperature and Deformation Effects on the Recrystallization Microstructure and Texture of Wire Draw Steel
p.447
Role of Recovery in the Recrystallization Simulation Application to a Cold Rolled IF-Ti Steel and a Cold Drawn Copper Wire
p.453
Recrystallisation Behavior of Cold Rolled Zr702: Influence of Rolling Direction and Thickness Reduction
p.459
Study of Grain Growth Kinetics in Submicrocrystalline Armco-Iron
p.465
Intercritical Annealing Behaviour of an Ultrafine Grained C-Mn Steel Obtained by Hot Torsion Deformation
p.471
Overview of Texture Evolution during Friction Stir Welding of Stainless Steel Using Crystal Plasticity and EBSD
p.479
Tracing the Goss Orientation during Deformation and Annealing of an FeSi Single Crystal
p.485
Orientation Selection in ULC Steel during Thermally Activated Phenomena Induced by Cold Deformation
p.491

Study of Grain Growth Kinetics in Submicrocrystalline Armco-Iron

Article Preview

Abstract:

The paper is devoted to the problem of thermal stability of ultra-fine grained (submicrocrystalline) materials prepared by severe plastic deformation. A basis of the paper lies in a fact that there is practically no grain growth in submicrocrystalline materials when annealing temperature is less than 0.35Tm. Reasons of high thermal stability of submicrocrystalline materials at low temperatures are widely discussed in literature. One of them is the affect of triple junction drag on grain boundaries motion. During annealing at a low temperature triple junction drag controls microstructure evolution in submicrocrystalline materials, and this phenomenon can be used to improve their thermal stability at high temperatures. The aim of this paper is to investigate grain growth kinetics in a two-step regime, low temperature and high temperature annealing. The experiments on grain growth were performed in submicrocrystalline Armco-iron fabricated by high pressure torsion. It is established that long-time low temperature pre-annealing reduces the grain growth rate in following high temperature annealing by a factor greater than two.

You might also be interested in these eBooks
Fundamentals of Deformation and Annealing View Preview

Info:

Periodical:

Materials Science Forum (Volume 550)

Pages:

465-470

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.550.465

Citation:

Cite this paper

Online since:

July 2007

Authors:

A.N. Aleshin, Alex M. Arsenkin, Sergey V. Dobatkin

Keywords:

ARMCO-Iron, Grain Boundary, Grain Growth, Submicrocrystalline Materials, Thermal Stability, Topological Class, Triple Junction

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2007 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] V.M. Segal, V.I. Reznikov, A.E. Drobyshevski and V.I. Kopylov: Rus. Metal (Engl. Transl. ) Vol. 1 (1981), p.115.

Google Scholar

[2] V.M. Segal: Mater. Sci. Eng. Vol. A197 (1995), p.157.

Google Scholar

[3] R.Z. Valiev, R.R. Mulyukov, and A.V. Korznikov: Mater. Sci. Eng. Vol. A168 (1993), p.141.

Google Scholar

[4] R.Z. Valiev: Nanomaterials by Severe Plastic Deformation, Edited by M. Zehetbauer and R. Z Valiev (Wiley-VCH Verlag GmbH & Co, Weinheim 2004), p.109.

DOI: 10.1002/3527602461

Google Scholar

[5] G. Gottstein and L.S. Shvindlerman: Acta Mat. Vol. 50 ( 2002), p.703.

Google Scholar

[6] W.W. Mullins: J. Appl. Phys. Vol. 27 (1956), p.900.

Google Scholar

[7] J. von Neumann: Metal Interfaces (American Society for Testing Materials, Cleveland 1952), p.108.

Google Scholar

[8] U. Czubayko, V.G. Sursaeva, G. Gottstein and L.S. Shvindlerman: Acta Mater. Vol. 46 (1998), p.5863.

DOI: 10.1016/s1359-6454(98)00241-9

Google Scholar

[9] S.G. Protasova, G. Gottstein, D.A. Molodov, V.G. Sursaeva and L.S. Shvindlerman: Acta Mater. Vol. 49 ( 2001), pp.2519-0. 4 0. 5 0. 6 0. 7 0. 8 0. 9 1. 0 1. 1 Normalised grain growth rate Λ.

DOI: 10.1016/s1359-6454(01)00142-2

Google Scholar