Paper Titles
Mode III Yoffe Dynamic Crack Problem on the Interface between Dissimilar Materials
p.42
Morphology Evolutions of the Short Fatigue Crack Propagation of 1Cr18Ni9Ti Weld Metal
p.46
The Grain Size and Porosity Dependent Constitutive Modeling for Nanocrystalline Ceramics with Small Plastic Deformation
p.50
Study on Impact Fatigue Life of 42CrMo Steel with M+F Dual-Phase Structure
p.54
Thermal Shock Properties of Ternary-Boride-Based Cladding Material
p.58
Fatigue Reliability Research on RD2 Axle of Railway Freight Car
p.62
Reconstruction of the Material Probabilistic S-N Relations with Given Confidence
p.66
Study on Complete Stress-Strain Experiment and Destruction Characteristics of Rock under Lower Confining Pressure
p.70
Three-Dimensional Elastic Stress Fields of Finite Thickness Plates with Elliptical Hole
p.74

Thermal Shock Properties of Ternary-Boride-Based Cladding Material

Article Preview

Abstract:

Thermal shock properties of Q235A steel used ternary-boride-based (TBB) cladding material has been studied. The result indicates that this cladding material has excellent resistance to thermal shock and that the cracks are not difficult to occur at the interface of cladding layer and steel substrate. The mechanism of thermal shock failure is fatigue failure brought by cycle stresses. The thermal shock has little influence on the hardness of cladding layer. The structure of cladding layer has no obvious change after the thermal shock, but the phase of steel substrate change from ferrite and pearlite to martensite.

You might also be interested in these eBooks
Progresses in Fracture and Strength of Materials and Structures View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 353-358)

Pages:

58-61

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.353-358.58

Citation:

Cite this paper

Online since:

September 2007

Authors:

Y.G. Wang, Zhao Qian Li, Ming Chen

Keywords:

Cladding Materials, Interface, Microstructure, Thermal Shock

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2007 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] Y.G. Wang, Z. Q: Li. Material Research Bulletin, Vol. 37, n3 (1996), pp.1-7.

Google Scholar

[2] D. Rao, G.S. Upadhyaya: P/M Science &Technology Briefs，Vol. 2, n4 (2000), pp.9-13.

Google Scholar

[3] K.A. Azam, L.J. Claude: Journal of the European Ceramic Society, Vol. 17, n15-16 (1997), pp: 1885-1890.

Google Scholar

[4] R. A. Miller, C. E. Lowell: Thin Solid Film, Vol. 95 (1982), pp.256-273.

Google Scholar

[5] S.H. Lee, D. Kwon: Thin Solid Films, Vol. 341, n1-2 (1999), pp.136-139.

Google Scholar

[6] X.H. Xiang, Z. Y Liu and S.Z. Li, Z.D. Yin, J.C. Zhu: The Chinese Journal of Nonferrous Metals, Vol. 9, n3 (1999), pp.520-525.

Google Scholar

[7] B.L. Wang, J.C. Han, S.Y. Du. Acta Materiae Compositae Sinica, Vol. 16, n1 (1999), pp.125-130.

Google Scholar

[8] Y.G. Wang, Z.Q. Li: Chinese Journal of Applied Mechanics, Vol. 19, n3 (2002), pp: 120-123 Fig. 4. SEM photograph of structure before thermal shock Cladding layer Q235A Fig. 5. SEM photograph of structure after thermal shock Cladding layer Q235A.

Google Scholar