Progresses in Fracture and Strength of Materials and Structures
Key Engineering Materials Volumes 353 - 358
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p2916
In Situ Thermal-Mechanical Fatigue Testing of Thin Au Lines
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2 M
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Authors: G.P. Zhang, B. Zhang, Q.Y. Yu, J. Tan -
p2920
Theoretical Analysis of Young’s Modulus and Dielectric Constant for Low-k Porous Silicon Dioxide Films
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215 K
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Authors: Ke Jia Li, Xia Xiao, Yu Feng Jin -
p2924
Micro/Nano Film Getters for Vacuum Maintenance of MEMS
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377 K
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Authors: Yu Feng Jin, Hao Tang, Zhen Feng Wang -
p2928
Isothermal Aging Effects on the Microstructure, IMC and Strength of SnAgCu/Cu Solder Joint
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1 M
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Authors: Xiao Yan Li, Xiao Hua Yang, Wei Zhen Dui, Ben Sheng Wu -
p2932
A Comparative Study of the Solder Joint Reliability in Flip Chip Assemblies with Compliant and Rigid Substrates
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344 K
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Authors: Yong Chen Lin, Xu Chen, Xing Shen Liu, Guo Quan Lu -
p2936
Behavior of Anisotropic Conductive Joints under Hygrothermal Conditions
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1 M
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Authors: Yong Chen Lin, Xu Chen, Jun Zhang -
p2940
Interface Cracking of Plastic Electronic Package under Temperature and Humidity Environment
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251 K
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Authors: Xu Chen, Shu Feng Zhao, Linda Zhai -
p2944
Shape Prediction and Reliability Design of Ball Grid Array Solder Joints
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572 K
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Authors: Yan Hong Tian, Chun Qing Wang -
p2948
Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules
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591 K
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Authors: Thomas G. Lei, Jesus Calata, Shu Fang Luo, Guo Quan Lu, Xu Chen -
p2954
Fluctuation Mechanism of Mechanical Properties of Electroplated-Copper Thin Films Used for Three Dimensional Electronic Modules
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1 M
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Authors: Hideo Miura, Kazuhiko Sakutani, Kinji Tamakawa
