Paper Titles
Absolute Measurement of Aspheric Surfaces Using White-Light Interferometry
p.80
An Enhanced Common Path Interference Measurement Method for Optical Refractive Indices
p.86
An Optical System for the Ball Grid Array Inspection and Measurement Using the Back-Propagation Neural Network Technology
p.92
Analytical Calculation of the Light Extraction Efficiency of Micro Cavities Light-Emitting Diodes
p.98
Automatic Optical Inspection and Laser Cleaning of Image Sensors
p.104
Evaluating Frequency Error Property of Wavefront of Large Optics by PSD Collapse
p.108
High Accuracy Confocal Full-Field 3-D Surface Profilometry for Micro Lenses Using a Digital Fringe Projection Strategy
p.113
Aspheric Mirror Testing with Phase Retrieval Method
p.117
An Investigation of Form Errors Predicted Model for Injection Moulded Aspheric VCD Lens
p.123

Automatic Optical Inspection and Laser Cleaning of Image Sensors

Article Preview

Abstract:

A new dry cleaning methodology named laser shock cleaning and optical inspection technique has been applied not only to remove the particles from the surfaces of image sensors but also to inspect the surfaces automatically before or after the cleaning. In the packaging of CMOS and CCD image sensing modules, the particles generated during the assembly process should be removed from the surfaces of image sensors in order to ensure clear image as well as to enhance the yield. The different kinds of particles were removed from the surfaces by the laser shock cleaning technique which utilizes the airborne shock wave induced by intense laser pulse. For the quantitative evaluation of cleaning performance, number, shape and size of the particles on the surfaces of image sensors were measured by vision inspection technique before and after cleaning. It was found that most particles on the surfaces were successfully removed after the treatment of laser-induced shock waves. The average removal efficiency of the particles was over 95 %. It is interestingly found that the remaining particles after the cleaning are based on organics, which are probably attached during the bonding process.

You might also be interested in these eBooks
Optics Design and Precision Manufacturing Technologies View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 364-366)

Pages:

104-107

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.364-366.104

Citation:

Cite this paper

Online since:

December 2007

Authors:

Jong Myoung Lee, Un Chung Cho

Keywords:

Image Sensor, Laser Cleaning, Optical Inspection, Shock Wave

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2008 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] R. DeJule: Semiconductor International (1998) 64.

Google Scholar

[2] J. M. Lee: Handbook of Semiconductor Technology, Hanrimwon (2003).

Google Scholar

[3] J. M. Lee: Lasers and Cleaning Process, Hanrimwon (2002).

Google Scholar

[4] Y. F. Lu, W. D. Song, M. H. Hong, et al: J. Appl. Phys. 80 (1996) 499.

Google Scholar

[5] J. M. Lee and K. G. Watkins: Optics Express 7 (2000) 68.

Google Scholar

[6] J. M. Lee, K. G. Watkins, W. M. Steen: Applied Physics A 71 (2000) 671.

Google Scholar

[7] J. M. Lee, C. Curran, K. G. Watkins: Applied Physics A 73 (2001) 219.

Google Scholar

[8] J. M. Lee, K.G. Watkins: J. Appl. Phys. 89 (2001) 6496.

Google Scholar

[9] J. M. Lee, K. G. Watkins, W. M. Steen: J. Laser Applications 13 (2001) 154.

Google Scholar

[10] H. Lim, D. Jang, D. Kim, J. W. Lee, J. M. Lee; J. Appl. 97 (2005) 054903-1~6 . Particle size 1~10 um > 10 um Total No of particles before cleaning 102 82 184 No of particles after cleaning 5 2 7 Removal efficiency (%) 95. 1 97. 6 96. 2 3.

DOI: 10.1063/1.1857056

Google Scholar