[1]
Hahn P.O.: Microelectronic Engineering Vol. 56(2001), p.3.
Google Scholar
[2]
N. Yasunaga, A. Obara and N. Tarumi: Res. Electrotech. Lab Vol. 776(1977), p.50.
Google Scholar
[3]
R . Komanduri: Annals of CIRP Vol. 45(1996), p.509.
Google Scholar
[4]
G. Nanz, L E. Camilletti: IEEE Transactions on Semiconductor Manufacturing Vol. 8(1995), p.382.
Google Scholar
[5]
G.H. Fu, Abhijit Chandra: IEEE Transactions on Semiconductor Manufacturing Vol. 14(2001), p.406.
Google Scholar
[6]
Y. Mori, N. Ikawa, T. Okuda and K. Yamagata: Technical Reports of the Osaka University Vol. 26(1976), p.283.
Google Scholar
[7]
Y. Mori, K. Yamauchi and K. Endo: Precision Engineering Vol. 10(1988), p.24.
Google Scholar
[8]
Y. Namba, H. Tsuwa: Annals of CIRP Vol. 26(1977), p.325.
Google Scholar
[9]
Y. Tani, K . Kawata: Annals of CIRP Vol. 33 (1984), p.217.
Google Scholar
[10]
N. Umehara: Annals of CIRP Vol. 43 (1994), p.185.
Google Scholar
[11]
Bo Zhang, Akira Nakajima: Precision Engineering Vol. 27(2003), p.1.
Google Scholar
[12]
J. Lkeno, Y. Tani and H. Sato: Annals of CIRP Vol. 39(1990), p.341.
Google Scholar
[13]
J. Lkeno, Y. Tani and A. Fukutani: Annals of CIRP Vol. 40(1991), p.351.
Google Scholar
[14]
Y. Tani, etc: Annals of CIRP Vol. 46(1997), p.245.
Google Scholar
[15]
C. J. Evans: Annals of CIRP Vol. 47(1998), p.239.
Google Scholar
[16]
J. Watanabe, J. Suzuki: Annals of CIRP Vol. 30(1981), p.91.
Google Scholar
[17]
Miyamoto I, Ezawa T, Nishimura K: Nanatechnology Vol. 1(1990), p.44.
Google Scholar
[18]
H.Y. Wang, D.L. Bourell: Materials Science and Technology Vol. 19(2003), p.382.
Google Scholar
[19]
Information on http: /www. cree. com/Products/GAN/downloads/CMP_for_Decoration. pdf.
Google Scholar
[20]
M. Raghunandan, R. Komanduri: Trans. ASME J. Manf. Sci. and Eng. Vol. 120(1998), p.376.
Google Scholar
[21]
Information on http: /www. ntem. com. cn/kjjx2/0427_sd_2. htm. (2002).
Google Scholar
[22]
M. Jiang, R. Komanduri: Key Engineering Materials, Vol. 202-203(2001), p.1.
Google Scholar
[23]
Y. Namba, H. Kobayashi, etc: Annals of the CIRP Vol. 48(1999), p.277.
Google Scholar
[24]
R.I. Trezona, D.N. Allsopp, I.M. Hutchings: Wear Vol. 225-229(1999), p.205.
Google Scholar
[25]
K. Adachi , I.M. Hutchings: Wear Vol. 255(2003), p.23.
Google Scholar
[26]
T. Kasai, K. Horio, T. Karaki-Doy: Annals of CIRP Vol. 39 (1990), p.297.
Google Scholar
[27]
R.E. Rosensweig: Ferrohydrodynmics(Cambridge University Press, U. K 1985).
Google Scholar
[28]
S. D. Jacobs , S. A. Arrasmith, etc: 101 annual Meeting of the American ceramic Society; Indianapolis, Indian. (1999).
Google Scholar
[29]
H. Ohmori, T . Nakagawa: Annals of CIRP Vol. 39(1990), p.329.
Google Scholar
[30]
H. Ohmori, T . Nakagawa: Annals of CIRP Vol. 44(1995), p.287.
Google Scholar
[31]
D. Kramer, etc: Annals of CIRP Vol. 48(1999), p.265.
Google Scholar
[32]
Hans H. Gatzen, J. Chris Maetzig: Precision Engineering Vol. 21(1997), p.134.
Google Scholar
[33]
Eda H, Zhou L, Nakano H, Kondo R, Shinizu J: Annals of CIRP Vol. 50(2001), p.225.
Google Scholar
[34]
Z. J. Pei, Strasbaugh Alan: International Journal of Machine Tools and Manufacture Vol. 41(2001), p.659.
Google Scholar
[35]
H.K. Xu, S. Jahanmir: J. Mater. Sci. Vol. 30(1995), p.2235.
Google Scholar
[36]
H. Ohmori, etc:. Annals of the CIRP Vol. 44(1995), p.287.
Google Scholar
[37]
S.M. Liu, D.L. Yu: Journal Of Chinese Electron Microscopy Society Vol. 17(1998), p.51.
Google Scholar
[38]
Y. Hagiuda, K. Karikomi, T. Nakagawa: Annals of the CIRP Vol. 30(1981), p.227.
Google Scholar
[39]
H.K. Tonshoff, R. Egger. W. Longerich, D. Preising: Manufacturing Engineering Vol. 120(1998), p.52.
Google Scholar
[40]
M. Anzai, H. Otaki, etc: Journal of the Japan Society of Powder and Powder Metallurgy Vol. 40(1993), p.833.
Google Scholar
[41]
Shigeki Khikawa, Hirosha Ona: Annals of the CIRP Vol. 42(1993), p.421.
Google Scholar