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Advances in Grinding and Abrasive Technology XIV

Key Engineering Materials Volumes 359 - 360

• Papers
• Abstracts

• p244 Experimental Investigation into Surface Integrity Finished by Abrasive Jet with Grinding Wheel as Restraint   [ 387 K ]
  Authors: Chang He Li, Shi Chao Xiu, Guang Qi Cai
• p249 Lapping Process of Diamond Cutting Tool by Molecular Dynamics Simulating   [ 880 K ]
  Authors: Zeng Qiang Li, Tao Sun, Yong Da Yan, Jun Jie Zhang, Ying Chun Liang, Shen Dong
• p254 Study on Contact Mechanism of Interface in Wafer CMP Based on Abrasion Behavior   [ 159 K ]
  Authors: Jian Xiu Su, Xue Liang Zhang, Xi Qu Chen, Jia Xi Du, Dong Ming Guo
• p259 Design of Surface Finish Using Synchronous Process of Grinding and Electrochemical Finishing   [ 158 K ]
  Authors: Pai Shan Pa
• p264 Hydrodynamic Analysis of Circular Translational Polishing under Mixed Lubrication   [ 245 K ]
  Authors: Wen Jie Zhai, Chang Xiong Liu, Pei Lian Feng
• p269 Research on Nanoscale Material Removal Process Using Atomic Force Microscopy   [ 4 M ]
  Authors: Fei Hu Zhang, Hua Li Zhang, Yong Da Yan, Jing He Wang
• p274 Experimental Study of Precision Polishing of Hard and Brittle Material   [ 189 K ]
  Authors: Li Hua Dong, Chun Hua Fan, Jian Huang, Hong Xia Luo
• p279 Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads   [ 1 M ]
  Authors: Juan Liu, Xi Peng Xu
• p285 Study on Mechanical Polishing for CVD Diamond Films of Forming Nucleus Surface and Growing Surface   [ 2 M ]
  Authors: Rong Fa Chen, Dun Wen Zuo, Wen Zhuang Lu, Duo Sheng Li, Feng Xu, Tong Ji, Min Wang
• p290 Research on the Hydrodynamic Electro-Chemical Mechanical Polishing for Silicon Wafer with Suspension Fluid   [ 208 K ]
  Authors: Jian Ming Zhan, Di Zheng