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Advanced Materials and Processing

Advanced Materials Research Volumes 26 - 28

• Papers
• Abstracts

• p551 Surface Roughness of Cu-Be Alloy (C17200) Rod Alloy Produced by Horizontal Type Continuous Casting Process   [ 507 K ]
  Authors: Sang Kil Lee, H.S. Lee, Sung Chul Lim, T.K. Jung, K.H. Kim, Hyuk Chon Kwon, W.M. Jung
• p555 Effects of Electric Pulse on Solidification Structure of KS282 Alloy   [ 16 M ]
  Authors: Li Jia He, Jian Zhong Wang, Jin Gang Qi, Da Qiang Cang
• p559 Fatigue Crack Characteristics of Friction Stir Welded Aluminum Alloy Joints   [ 4 M ]
  Authors: Hong Qiu Qu, Masato Tsujikawa, Sung Wook Chung, Tomotaka Hirata, Sachio Oki, Kenji Higashi
• p563 Alignment of Primary Phase of a Binary Alloy during Solidification   [ 278 K ]
  Authors: Kazuhiko Iwai, Manabu Usui, Shigeo Asai
• p569 Microstructure and Properties of Cu-3.2Ni-0.75Si-0.3Zn Alloy for Lead Frame   [ 288 K ]
  Authors: Yi Zhang, Ping Liu, Bao Hong Tian, D.M. Zhao, Shu Guo Jia, X.H. Cheng
• p573 Preparation of CaAl₂O₄: Eu²⁺ Long Persistent Blue Phosphor   [ 1 M ]
  Authors: K.S. Bartwal, B.K. Singh, H. Ryu
• p577 Large Isothermal Magnetic Entropy Change after Hydrogen Absorption into La_0.5Pr_0.5(Fe_0.88Si_0.12)₁₃   [ 257 K ]
  Authors: S. Fujieda, A. Fujita, Kazuaki Fukamichi
• p581 Exchange Bias Field Change of FeMn-NiFe Films by He Ion Irradiation Using DuoPIGatron Source   [ 189 K ]
  Authors: Y.O. Noh, Cheol Gi Kim, Chong Oh Kim
• p585 Electrodeposited Nickel Nanowire Arrey   [ 3 M ]
  Authors: B.H. Park, I. Kim
• p589 Effect of Continuous Casting Parameters on Microstructure and Texture of Gold Bonding Wire for Semiconductor Packaging   [ 836 K ]
  Authors: Won Yong Kim, Han Sol Kim, Eun Kyun Chung