HOME CONTACT

Username: Password:

> @scientific.net

Eco-Materials Processing and Design IX

Materials Science Forum Volume 569

• Papers
• Abstracts

• p81 Analysis of Cell Toxic Experiments in New Synthetic Compounds from Nano-Scaled Collagen   [ 4 M ]
  Authors: Jong Hae Kim, Won Chul Choi
• p85 Corrosion Resistance of TiAlN/ZrN and TiCrN/ZrN Multilayers during Heat Treatment   [ 3 M ]
  Authors: Dong Hwan Song, Jong Kook Lee, Dong Seok Seo, Gon Seung Yang
• p89 Mechanical Performances of ZTM/SiC Nanocomposite Optimized through Composition and Microstructure Tailoring   [ 1 M ]
  Authors: Xi Hai Jin, Lian Gao, Jing Sun
• p93 Phase Analysis in the Region Brazed with Ni-14Cr-10Co-3.5Al-2.5Ta-2.8B Filler Metal Using Electron Backscatter Diffraction   [ 4 M ]
  Authors: Y.H. Kim, S.I. Kwun
• p97 The Mechanical Properties of AlN/BN Laminated Ceramic Composites   [ 614 K ]
  Authors: Tao Zhang, Hai Yun Jin, Yong Ian Wang, Zhi Hao Jin
• p101 Comparative Studies on Microstructure and Mechanical Properties of CrN, Cr-Mo-N and Cr-Si-N Coatings   [ 1 M ]
  Authors: Ji Hwan Yun, Sung Kyu Ahn, Kwang Ho Kim
• p105 Syntheses and Mechanical Properties of Ti-Al-Si-C-N Coatings by a Hybrid Coating System   [ 289 K ]
  Authors: Eun Young Choi, Ji Hoon Park, Kwang Ho Kim
• p109 Pressureless Brazing of Zirconia to Stainless Steel Using Active Filler Metal with TiH₂ Powder   [ 16 M ]
  Authors: Gui Wu Liu, Guan Jun Qiao, Hong Jie Wang, Jian Feng Yang, Tian Jian Lu
• p113 Investigation of Cu/Al Metal Laminates Prepared by Plasma Activated Sintering (PAS)   [ 1 M ]
  Authors: Ya Jie Guo, Jian Ping Lin, Guan Jun Qiao, Hai Yun Jin
• p117 Two-Step Planarization of ECMP and CMP for MEMS Copper Patterns   [ 364 K ]
  Authors: Suk Hoon Jeong, Suk Bae Joo, Ho Jun Lee, Boum Young Park, Hyoung Jae Kim, Hae Do Jeong