Paper Titles
Synthesis of Ti3Si0.4Al0.8C1.8 Solid Solution
p.995
Pressureless Sintering and Properties of Cu/Ti3AlC2 Composites
p.998
Argon-Arc Welding of Cu/Ti3AlC2 Cermet
p.1001
Fabrication of Ti2AlC/TiAl Composites with the Addition of Niobium by Spark Plasma Sintering
p.1004
Preparation and Microstructural Evolution of Sol-Gel-Derived Enstatite Fibers
p.1007
Wear Properties of Basalt Fibers Reinforced Composites
p.1010
Preparation of Mg,Al-Hydrotalcite/PE-EVA Flame-Retardant Nanocomposite
p.1013
Effects of CVD C or SiC on the Mechanical and Chemical Properties of Carbon Fibers
p.1016
Damage of T300 Carbon Fiber during Precursor Pyrolysis
p.1019

Preparation and Microstructural Evolution of Sol-Gel-Derived Enstatite Fibers

Article Preview

Abstract:

Homogeneous and transparent enstatite fibers were prepared via the sol-gel process of metal alkoxide precursors. The gel-to-ceramic conversion was characterized. The solution compositions had a significant influence on the microstructural evolution of gel fibers. Infrared studies indicated that bidentate bridging ligands were formed between acetate and metal ions, which enhanced spinnability remarkably. The as-drawn fibers were essentially microporous. On heating to 800 oC, enstatite ceramic fibers exhibited mesoporous structures with nanocrystals in size. The optical transmittance of enstatite ceramic fiber in the visible range was around 90 % after heating at 800 oC.

You might also be interested in these eBooks
High-Performance Ceramics V View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 368-372)

Pages:

1007-1009

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.368-372.1007

Citation:

Cite this paper

Online since:

February 2008

Authors:

M.T. Tsai, P.J. Tsai, H.C. Chang

Keywords:

Alkoxide Sol-Gel, Crystallization, Enstatite Fiber, Microstructure

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2008 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] H. Dislich: Angew. Chem. Int. Edit. Engl. Vol. 10 (1971) p.363.

Google Scholar

[2] S. Sakka: J. Sol-Gel Sci. Technol. Vol. 26 (2003) p.29.

Google Scholar

[3] T. Ban, Y. Ohya and Y. Tokahashi: J. Am. Ceram. Soc. Vol. 82 (1999) p.22.

Google Scholar

[4] M.T. Tsai: J. Am. Ceram. Soc. 85 (2002) p.453.

Google Scholar

[5] R. Weisharth and M. Jansen: J. Mater. Chem. Vol. 13 (2003) pp. (1926).

Google Scholar

[6] R.C. Buchanan: Ceramic materials for electronics 2nd. Ed. (Marcel Dekker lnc., New York, 1991).

Google Scholar