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Intergranular and Interphase Boundaries in Materials

Materials Science Forum Volumes 207 - 209

• Papers
• Abstracts

• p221 A Candidate for Grain Boundary Pipe Diffusion and Intrinsic Electrical Activity in Silicon   [ 234 K ]
  Authors: O.B.M. Hardouin Duparc, M. Torrent
• p225 Atomistic Simulation of Grain Boundaries in Alumina   [ 222 K ]
  Authors: M. Exner, Mike W. Finnis
• p229 Grain Boundary Structure in Ni₃Al   [ 222 K ]
  Authors: D. Farkas
• p233 Epitaxy of Deposited α-Fe Films on High-Index Cu Substrate Planes   [ 256 K ]
  Authors: T. Fujii, N. Sarlis, Shozo Inoue, Masashi Kato
• p237 Interfaces in SiC/C CVD Multilayers   [ 394 K ]
  Authors: F. Gourbilleau, Gerard Nouet, M. Ducarroir
• p241 Atomic Structure of the Interface between Epitaxial Niobium Films and α-Al₂O₃ Substrates   [ 234 K ]
  Authors: G. Gutekunst, J. Mayer, M. Rühle
• p245 Determination of the Atomistic Structure of the ∑3 (111) Twin Boundary in NiAl   [ 205 K ]
  Authors: M. Hagen, Mike W. Finnis
• p249 Direct Free Energy Estimates along a Real Path by Means of Constrained Molecular Dynamics   [ 216 K ]
  Authors: M. Hou, A. Hairie, B. Lebouvier, E. Paumier, N. Ralantoson, O.B.M. Hardouin Duparc, A.P. Sutton
• p253 Faceted Voids and Grain Orientation at Solid State Diffusion Bonded Interfaces between Cu and Single Crystal Cubic ZrO₂   [ 226 K ]
  Authors: Hitoshi Ishii, J.D. Mun, A.J. Wilkinson, B. Derby, A.P. Sutton
• p257 Analysis of Symmetric Triple Junctions   [ 259 K ]
  Authors: Alexander H. King, V. Singh