Creep and Fracture of Engineering Materials and Structures
Key Engineering Materials Volumes 171 - 174
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p633
Creep Behavior of Aluminum Alloy Foils for Microelectronic Circuits
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336 K
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Authors: Qing Zhou, Goroh Itoh -
p639
Creep and Evolution of Dynamic Recrystallization in Single Crystals of Ti-48at%Al with Different Orientation between Stress Axis and γ Lamellar Plate
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442 K
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Authors: N. Shiratori, S. Hirata, T. Asai, Masao Takeyama, T. Matsuo -
p647
Anomalous Creep Curve of Cu-30 Mass%Zn Alloy
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673 K
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Authors: A. Muto, Seishi Goto, M. Tagami -
p655
Deformation Mechanisms in Tin and Tin-Based Electronic Solder Alloys
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367 K
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Authors: M.D. Mathew, S. Movva, K.Linga Murty -
p663
Effect of Microalloying on the Creep Strength and Microstructure of Eutectic Sn-Pb Solders
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398 K
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Authors: Noboru Wade, T. Akuzawa, J. Kunii, K. Miyahara -
p669
Microstructures and Fracture Behaviours of Ir-Nb Two-Phase Refractory Superalloys Containing Various Amounts of Nb, Ni, Mo, C and B
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723 K
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Authors: Yue Feng Gu, Yoko Yamabe-Mitarai, Y. Ro, Hiroshi Harada -
p677
Investigation on Microstructure and Fracture of Quaternary Ir-Based Alloys
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568 K
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Authors: X.H. Yu, Yoko Yamabe-Mitarai, Y. Ro, Hiroshi Harada -
p685
Role of Interfacial Dislocations on Creep of a Fully Lamellar TiAl
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560 K
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Authors: T.G. Nieh, L.M. Hsiung -
p693
Microstructural Evolution Associated with Creep Rate Minima in Pure- and Near-γ TiAl Intermetallics
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983 K
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Authors: Antonín Dlouhý, K. Kuchařová, T. Horkel -
p701
A New Microstructural View of Creep in Near-γ TiAl-Alloys
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477 K
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Authors: B. Skrotzki
