Advances in Abrasive Technology V
Key Engineering Materials Volumes 238 - 239
-
p235
Material Removal Mechanism in Dynamic Friction Polishing of Diamond
[
644 K
]
Authors: Kiyoshi Suzuki, Manabu Iwai, Tetsutaro Uematsu, Nobuo Yasunaga -
p241
An Analysis of the Pad Deformation for Improved Planarization
[
99 K
]
Authors: Thin-Lin Horng -
p247
A Study of Nano-Polishing of Injection Molds Using a Fixed Abrasive Pad
[
1 M
]
Authors: Jae Young Choi, Ho Youn Kim, Jae Hong Park, Hae Do Jeong, Heonduc Seo -
p253
Development of New Mica Abrasives Suitable for High Performance Mechanochemical Polishing of Si Wafers
[
1 M
]
Authors: Nobuo Yasunaga, Shojiro Okada -
p257
Development of a Polishing Disc Containing Granulated Fine Abrasives
[
537 K
]
Authors: Hiroki Nakamura, Ji Wang Yan, Katsuo Syoji, Y. Wakamatsu -
p263
Autonomous Tool Path Generation in Robotic Polishing of an Aluminum Alloy
[
291 K
]
Authors: A.A. Akbari, S. Higuchi -
p271
Development of an Ultra-High Speed Cutting Wheel
[
1 M
]
Authors: S. Yamazaki, Katsuo Syoji, Tsunemoto Kuriyagawa, Y. Ogura, T. Fukunishi, M. Miyake -
p277
Development of Grinding Wheels by Stereolithography and Investigation of their Characteristics
[
361 K
]
Authors: Takeshi Tanaka, Kenichi Okushima -
p283
The Effects of Hard Lubricant Coatings on the Performance of Electro-Plated Superabrasive Grinding Wheels
[
35 K
]
Authors: Stuart C. Salmon -
p289
Effectiveness of Laser Cleaning for Grinding Wheel Loading
[
65 K
]
Authors: Xun Chen, Zheng Ming Feng
