TEM/SEM Morphological Analysis of Dental Tissue-Resin Bonding System in Dry and Wet Conditions

Article Preview

Abstract:

You might also be interested in these eBooks

Info:

Periodical:

Key Engineering Materials (Volumes 240-242)

Pages:

357-360

Citation:

Online since:

May 2003

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2003 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] AKIMOTO,N. et al. Remineralization across the resin-dentin interface: In vivo evaluation with nanoindentation measurements, EDS and SEM. Quintesence Int. 2001; 32:561-570.

Google Scholar

[2] TAY, F.C. et al. Resin Permeation into Acid-conditioned, Moist, and Dry Dentin: A Paradigm using Water-free Adhesive Primers. J. Dent. Res. 1996 75 ( 4) : 1034-1044.

DOI: 10.1177/00220345960750040601

Google Scholar

[3] NAKABAYASHI, N. Resin reinforced dentin due to infiltration of monomers into dentin at the adhesive interface. J. Jpm. Dent. Mater 1982 5: 54-64.

Google Scholar

[4] TAM, L. E.; PILLIAR, R. M. The effect of interface stiffness on dentin-composite interfacial fracture resistance. J. Dent. 2000 28: 487-493.

DOI: 10.1016/s0300-5712(00)00028-2

Google Scholar

[5] SWIFT, E.J.;PERDIGÃO, J. Bonding to enamel and dentin: A brief history and state of the art, 1995 Quint. Intern. 1995 26:95110.

Google Scholar

[6] GWINNET AJ. ; MATSUI, AA A Study of enamel adhesives. The physical relationship between enamel and adhesive. Arch. Oral Bio. 1967 13:61-70.

Google Scholar

[7] RETIEF DH. Effect of conditioning the enamel surface with phosphoric acid. J. Dent. Res. 1973 52:33-341.

DOI: 10.1177/00220345730520022401

Google Scholar

[8] SILVERSTONE LM. Fissure sealants:Laboratory studies. Caries Res. 1974 8:2-26.

Google Scholar

[9] BARKMEIER WW.; SHAFFER SE. Effects of enamel etching on bond strength and morphology. J. Clin. Orthod 1985 19:36-38.

Google Scholar

[10] SUZUKI K. Adhesion of restorative resin to teeth:Effects of functional groups of dentin primer to collagen. Dental Materials and Devices 200 36:93-97

Google Scholar