Paper Titles
Improvement of the Oxidation Resistance of EPM Gamma-TiAl Alloy by Y-Addition
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Microstructure Control of DS NiAl/Ni3Al Alloy by Fabrication of Columnar-Grained NiAl Martensite
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High Temperature Oxidation of Ti-(43~52%)Al-2%W-(0~0.5%)Si Intermetallics
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Syntheses of Metastable Trialuminides by Mechanical Alloying
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Effects of Si and B Additions on the Thermal Stability of Lamellar Microstructure of TiAl Alloys
p.1831
The Effect of Li, Ce and Ni Additions on the Microstructure and the Mechanical Properties in the AlFe Intermetallic System
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Properties of γ-TiAl-M (M = Ag, Cr) Sputtered Films
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Strangeness of Deformation Behavior of Intermetallics
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Reaction Sintering of an Aluminium-Based Ternary Intermetallic and its Properties
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Effects of Si and B Additions on the Thermal Stability of Lamellar Microstructure of TiAl Alloys

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Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

1831-1836

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.1831

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Online since:

August 2003

Authors:

Seong Woong Kim, Ho Nyun Lee, Myung Hoon Oh, Masaharu Yamaguchi, Dang Moon Wee

Keywords:

Directional Solidification, Lamellar Microstructure, Stable Composition, Thermal Stability, TiAl

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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