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HomeMaterials Science ForumMaterials Science Forum Vols. 426-432Strain-Rate Dependence of Dynamic Twin Nucleation...

Strain-Rate Dependence of Dynamic Twin Nucleation at Triple Junction in Copper

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THERMEC'2003

Info:

Periodical:

Materials Science Forum (Volumes 426-432)

Pages:

4387-4392

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.426-432.4387

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Online since:

August 2003

Authors:

Hiromi Miura, Sutandyo Andiarwanto, Tetsuo Sakai

Keywords:

Copper (Cu), Dynamic Recrystallization (DRX), Grain Boundary Sliding (GBS), Nucleation, Orientation Image Microscopy (OIM), Triple Junctions, Twining

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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