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Eco-Materials Processing & Design IV

Materials Science Forum Volume 439

• Papers
• Abstracts

• p1 Lead-Free Layered Perovskite Film Capacitor for Ferroelectric Random Access Memory   [ 296 K ]
  Authors: Uong Chon, Jeong Seob Shim, Hyun M. Jang
• p7 Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints   [ 713 K ]
  Authors: K.S. Kim, Katsuaki Suganuma, Toshitada Shimozaki, C.G. Lee
• p12 Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability   [ 426 K ]
  Authors: Jong Min Kim, Young Eui Shin, Kozo Fujimoto
• p18 Application of Lead-Free Glass to Barrier Rib Materials in Plasma Display Panel   [ 1 M ]
  Authors: Hyung Sun Kim, Byung Hae Jung
• p23 Joining and Processing in Engineering Ceramics to Metallic Materials, in Biomorphic SiC Ceramics, and in Bioactive and Bioinert Ceramics   [ 1 M ]
  Authors: J. Ernesto Indacochea
• p30 Biocompatibility of Plasma-Sprayed Biomedical Coatings   [ 5 M ]
  Authors: Chuan Xian Ding, Xuan Yong Liu, Xue Bin Zheng
• p34 TiO₂-Coated Plastic Optical Fibers for Purification   [ 508 K ]
  Authors: Hong Dae Shin, Hyun Ku Joo
• p40 Porosity Variation on the Compressive Deformation of Pre-Sintered Al-Si-Fe Based Alloy   [ 701 K ]
  Authors: Gyu-Sam Shim, Mok Soon Kim, Won Yong Kim, Hiroshi Yamagata
• p46 Mechanical Characteristics of Mg and its Composites Recycled from Mg Chips   [ 270 K ]
  Authors: Si Young Chang, Jin Chun Kim, Seung Kyun Ryu, Sung Tag Oh, Kae Myung Kang
• p51 Viscosity and Surface Tension of Al and Effects of Additional Element   [ 93 K ]
  Authors: Bo Young Hur, Soo Han Park, Arai Hiroshi