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HomeKey Engineering MaterialsKey Engineering Materials Vol. 247Grain Boundary Electronic Structure and...

Grain Boundary Electronic Structure and High-Temperature Plastic Flow in Polycrystalline Al₂O₃

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Advanced Ceramics and Composites

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Periodical:

Key Engineering Materials (Volume 247)

Pages:

263-266

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.247.263

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Online since:

August 2003

Authors:

Hidehiro Yoshida, Yuichi Ikuhara, Taketo Sakuma

Keywords:

Aluminum (Al), Creep, Grain Boundary, High Resolution Transmission Electron Microscopy, Molecular Orbital Calculation

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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