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Advances in Abrasive Technology VI

Key Engineering Materials Volumes 257 - 258

• Papers
• Abstracts

• p365 Comparison of Laser Cleaning of Al₂O₃ and CBN Grinding Wheels   [ 755 K ]
  Authors: Xun Chen, Zhi Jing Feng, I.R. Pashby
• p371 A Study of the Characteristics of the Diamond Dresser in the CMP Process   [ 377 K ]
  Authors: Yunn Shiuan Liao, P.W. Hong, C.T. Yang
• p377 A Study on the Dressing Rate in CMP Pad Conditioning   [ 389 K ]
  Authors: Pei Lum Tso, S.Y. Ho
• p383 Pad Surface Characterization and its Effect on the Tribological State in Chemical Mechanical Polishing   [ 262 K ]
  Authors: Hyoung Jae Kim, Hae Do Jeong, E. Lee, Y. J. Shin
• p389 Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance   [ 1 M ]
  Authors: Dae Hong Eom, J.S. Ryu, Jin Goo Park, J.J. Myung, Kyung Su Kim
• p395 A Study of an Ultra-Precision CNC Polishing System   [ 597 K ]
  Authors: S.J. Han, J.K. Choi, Seok Woo Lee, Hon Zong Choi
• p401 Pressure-Based Grinding and Polishing of Free-Form Lenses with Spherical Tools   [ 225 K ]
  Authors: Yun Zhang, Zhi Jing Feng, Yong Bo Wu
• p407 Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing   [ 963 K ]
  Authors: Junji Watanabe, Tohru Hisamatsu, M. Hirano
• p413 A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method   [ 619 K ]
  Authors: Jae Young Choi, Hwan Kim, J. Park, S. Chung, Hae Do Jeong, M. Kinoshita
• p417 A New Process for Internal Polishing of Cemented Carbide Using a Vibrating Tool with Two-Dimensional Small Motions   [ 771 K ]
  Authors: C. Yamamoto, I. Nakada, T. Kuboi, Takeo Shinmura