Comparison of Metal-Oxide Nanoparticle Formation in the Cu and Sn Thin Films by the Reaction with Polyimide

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Abstract:

We developed a simple method of producing metal oxide nanoparticles by reacting a polyamic acid (PAA) with Cu or Sn metal films. Respective particle size, distribution, and morphology were characterized by transmission electron microscopy (TEM). The morphology of metal oxides dispersed in the polyimide is different in Cu and Sn metal films. The Cu2O particles were formed by the dissolution reaction between the polyamic acid and the Cu films. During curing, PAA dehydrates and converts to polyimide, accompanied by precipitation of Cu2O particles. The synthesized Cu2O particles were randomly dispersed within the polyimide. And their particle size was relatively uniform, having a narrow distribution. Mostly nanosize Cu2O particles were formed in the specimen made from 10 nm thick Cu film and the mixture of nanosize particles and Cu layers were observed in the 30 nm thick Cu film. On the other hands, the Sn film undergoes surface reaction with the polyamic acid. Therefore, the synthesized SnO2 particles existed only at the surface of the substrate. SnO2 particle size distribution was not uniform in the polyimide. Although particles were not distributed uniformly in the polyimide, they were confined in a monolayer. The different particle distributions were attributed to the reactivity difference of PAA with Cu and Sn films.

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Materials Science Forum (Volumes 449-452)

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1237-1240

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March 2004

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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[1] Y. Wang and N. Herron: J. Phys. Chem., Vol. 95, (1991) pp.525-532.

Google Scholar

[2] Masanori Tanaka, Shinya Sawai, Masaya Sengoku, Manabu Kato, and Yasuaki Masumoto: J. Appl. Phys., Vol. 87, No. 12, (2000) pp.8535-8540.

Google Scholar

[3] Christopher Bruce Murray, and Shouheng Sun: USPTO. US 6, 262, 129 B1, (2001).

Google Scholar

[4] Thierry Cassagneau and Janos H. Fendler: J. Phys. Chem. B, Vol. 103 (1999) pp.1789-1793.

Google Scholar

[5] S. Banerjee and D. Chakravorty: J. Appl. Phys., Vol. 87, No. 12, (2000) pp.8541-8544.

Google Scholar

[6] P. Taneja, R. Chandra, R. Banerjee, and P. Ayyuub: Scripta Mater. Vol. 44 (2001) p.1915-(1918).

Google Scholar

[7] Yoon Chung, Hwan-pil Park, Hyung Jun Jeon, C. S. Yoon, Sung K. Lim, and Young-Ho Kim: J. Vacuum Sci. Technol. B, (2003): accepted.

Google Scholar

[8] Steven P. Kowalczyk, Young-ho Kim, G. F. Walker, and J. kim: Appl. Phys. Lett. Vol. 52, No. 5, (1988) pp.375-376.

Google Scholar

[9] Sung K. Lim, Keum Jee Chung, Young-Ho Kim, C. K. Kim, C. S. Yoon: J. Magnetism & Magnetic Materials (2003): accepted.

Google Scholar