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Mechanics of the Micro Cutting by Abrasive Particle at Vibroabrasive Processing

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Abstract:

The results of the research of the interaction of the abrasive granule with processed surface at vibroabrasive processing are presented. The mechanism of the micro cutting process is described on the base of the analysis of the nature of single traces of the processing, dynamic parameters of the process, geometric parameters of abrasive grains and granules.

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Advances in Abrasive Technology VIII View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 291-292)

Pages:

309-314

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.291-292.309

Citation:

Cite this paper

Online since:

August 2005

Authors:

Anatoly P. Babichev

Keywords:

Abrasive Environment, Abrasive Granules, Adhesion, Adsorption, Chip Forming, Contact Platforms, Deformation, Micro Relief, Physicochemical Processes, Stress, Sub-Micro Relief, Traces of the Processing, Vibratory Influence, Vibroabrasive Processing

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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References

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