Paper Titles
Optical Grain Size Measurements: What is Being Measured? Comparative Study of Optical and EBSD Grain Sizes Determination in 2D Al Foil
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Unbiased Evaluation of Chord Length Distributions from Orientation Maps
p.219
Extension of Orientation Mapping to the Transmission Electron Microscope
p.225
Effect of Orientation Noise on the Determination of Percolation Thresholds from Electron Back-Scatter Pattern Data
p.231
Three-Dimensional Texture Analysis
p.237
High Resolution Texture Analysis with Spherical Wavelets
p.245
Combined Synchrotron and Neutron Strcutural Refinement of R-Phase in Ti50.75.Ni47.75.Fe1.50 Shape Memory Alloy
p.255
On Probability - Statistical Representation of Pole Figures for Materials with Hexagonal Symmetry
p.261
Determination of an ODF from Diffraction Measurements Based on Optimal Smoothing Splines
p.267

Three-Dimensional Texture Analysis

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Abstract:

Three-dimensional (3D) microscopy is a new and rapidly expanding area. A DualBeam system, with both a focused ion beam (FIB) column and an electron column, is a powerful instrument for imaging and sectioning microstructures to generate a full 3D sample reconstruction. When an electron backscatter diffraction (EBSD) system is attached to the DualBeam, it becomes a unique tool for making 3D crystallographic measurements on a wide variety of materials. Combining the successive removal by FIB, with sequential EBSD maps taken with the electron beam requires clear geometric considerations and a high level of automation to obtain a decent resolution in the third dimension, including positional sub-pixel re-alignment. Complete automation allows controlled sectioning and analysis of a significant volume of material without operator intervention: a process that may run continuously and automatically for many hours. Using a Nova600, a Channel 6 EBSD system and dedicated control software, Aluminium, Nickel and Steel specimens have been examined and volumes with up to 200 slices have been successfully analysed.

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Periodical:

Materials Science Forum (Volumes 495-497)

Pages:

237-244

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.495-497.237

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Online since:

September 2005

Authors:

J.J.L. Mulders, A.P. Day

Keywords:

3D-Microscopy, Crystallography, Dual Beam Automation, Dual Beam Geometry, Electron Backscatter Diffraction (EBSD), Electron Backscattered Pattern (EBSP), Focused Ion Beam (FIB), Interpretation, Visualisation

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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References

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