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New Frontiers of Processing and Engineering in Advanced Materials

Materials Science Forum Volume 502

• Papers
• Abstracts

• p309 Reflecting Multi-Layer Coatings by RF Sputtering   [ 419 K ]
  Authors: Fujio Tamai, Yuji Kawakami
• p315 Enhancement of Adhesive Strength of DLC Film by Plasma-Based Ion Implantation   [ 193 K ]
  Authors: M. Kirinuki, Akifumi Tomita, M. Kusuda, Yoshihiro Oka, A. Murakami, Mitsuyasu Yatsuzuka
• p321 Comparison of Different Types of Plasma in Radioactive Surface Decontamination Process   [ 24 M ]
  Authors: M. Suzuki, M. Kadowaki, F.H. Windarto, S. Mori
• p327 Manipulation Mechanisms for Micro-Assembly Technology   [ 159 K ]
  Authors: Kunio Takahashi
• p335 In Situ X-Ray Diffraction Measurement of Electrodeposition Process in Molten Salts   [ 103 K ]
  Authors: Akihiko Kajinami, Shigehito Deki, Norimasa Umesaki, Masugu Sato, Munetaka Myochin
• p339 In Situ Neutron Diffraction Analysis of Phase Transformation Kinetics in TRIP Steel   [ 2 M ]
  Authors: J. Zrník, O. Muránsky, Petr Lukáš, Petr Šittner, Z. Nový
• p345 Internal Friction Influenced by Hydrogen in Super Duplex Stainless Steels   [ 1 M ]
  Authors: Toshio Kuroda, Katsuyuki Nakade, Kenji Ikeuchi
• p351 Laser-Assisted CMP for Copper Wafer   [ 3 M ]
  Authors: Taeho Ha, Keiichi Kimura, Takashi Miyoshi, Yasuhiro Takaya
• p361 Development of Technology for Reduction Process of Copper Production   [ 217 K ]
  Authors: Živan Živković, Dragana Živković, Aca Jovanovic, Ivan Mihajlovic
• p367 Fabrication of Lotus-Type Porous Metals, Intermetallic Compounds and Semiconductors   [ 7 M ]
  Authors: Hideo Nakajima