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New Frontiers of Processing and Engineering in Advanced Materials

Materials Science Forum Volume 502

• Papers
• Abstracts

• p373 Study on Morph-Genetic Materials Derived from Natural Structure   [ 2 M ]
  Authors: Di Zhang, Tong Xiang Fan, Bing He Sun, Tian Chi Wang, Xian Qing Xie, Toshihiro Okabe
• p379 Fabrications and Corrosion Resistance of Iron-Aluminum Alloy/High Carbon Steel Composites Prepared by Clad Rolling   [ 1 M ]
  Authors: N. Masahashi, K. Komatsu, G. Kimura, Sadao Watanabe, Shuji Hanada
• p385 EB Induced Stress Relaxation of Tight Network Structure in Silica and Soda Glasses   [ 252 K ]
  Authors: Yoshitake Nishi, Naoki Yamaguchi, Kousuke Takahashi, Kazuya Oguri, Akira Tonegawa
• p393 Selection of Proper Fatigue Model for Flip Chip Package Reliability   [ 2 M ]
  Authors: Young Eui Shin, Yeon Sung Kim, Hyoung-Il Kim, Jong Min Kim, Kyong Ho Chang, Dave F. Farson
• p399 Indentation Rate-Dependent Creep Behavior of Sn-Ag-Cu Pb-Free Ball Grid Array (BGA) Solder Joint   [ 401 K ]
  Authors: Feng Jiang Wang, Xin Ma, Yiyu Qian
• p405 Effect of Grain Size on Reaction between Pb-Free Solder and Plated Iron   [ 1 M ]
  Authors: Hiroshi Nishikawa, Tadashi Takemoto, Takashi Uetani, Norihisa Sekimori
• p411 Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings   [ 806 K ]
  Authors: Keisuke Uenishi, Kojiro F. Kobayashi
• p417 The Effects of Thickness and Underlayer on Both Grain Growth and Internal Stresses in Cu Thin Films   [ 24 M ]
  Authors: Shinji Takayama, Makoto Oikawa
• p425 Production of Diamond Tools by Brazing   [ 5 M ]
  Authors: Wolfgang Tillmann, Artur Martin Osmanda
• p431 Novel Method for Diffusion Bonding Superalloys and Aluminium Alloys (USA Patent 6,669,534 B2, European Patent Pending)   [ 2 M ]
  Authors: A.A. Shirzadi, E.R. Wallach