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Progress on Advanced Manufacture for Micro/Nano Technology 2005

Materials Science Forum Volumes 505 - 507

• Papers
• Abstracts

• p1081 Elastic Buckling Analysis of Die Fins during Extrusion   [ 261 K ]
  Authors: Yeong Maw Hwang, Chi Yu Wu, Ging Ian Shin
• p1087 A New Class of Structured Light Patterns for 3-D Imaging Systems   [ 187 K ]
  Authors: Yi-Chih Hsieh
• p1093 A Molecular Dynamics Investigation into the Cooling Characteristics of Ni and Cu Alloys at High Pressure   [ 819 K ]
  Authors: Ming Horng Su, Hung Chang Chen
• p1099 Approximating the Minimum-Bounding Box of a 3D Model with Minimum Spans for Flush Edges   [ 435 K ]
  Authors: Tzung Han Lin
• p1105 The Inverse Prediction of the Geometry of a Two Dimensional Plate with a Rectangular Cavity   [ 187 K ]
  Authors: Chin Ru Su, Cha'o Kuang Chen
• p1111 An Interactive Web-Based Learning System for Manufacturing Technology Education   [ 2 M ]
  Authors: Min Jou, Han Wei Zhang
• p1117 Performance Measurement of Implementing Manufacturing Execution System   [ 306 K ]
  Authors: Kai Ying Chen
• p1123 Optimization of Component Placement Scheduling for SMT Assemblies   [ 254 K ]
  Authors: Chung Hsien Kuo, M.D. Jeng, J.J. Wing, Tai Hong Wang
• p1129 Vehicle Clustering Phenomenon in Automatic Materials Handling Systems in 300mm Semiconductor Manufacturing   [ 176 K ]
  Authors: Da Yin Liao
• p1135 Diagnosability of Semiconductor Manufacturing Equipment   [ 24 M ]
  Authors: Yuan Lin Wen, M.D. Jeng, Yi Sheng Huang