Eco-Materials Processing & Design VII

Materials Science Forum Volumes 510 - 511

p522 Textures and Mechanical Properties of Melt-Extruded Al-Cu Alloys [ 750 K ]
Authors: B.S. Lee, Dae Heon Joo, M. Ryou, Myung Ho Kim
p526 Effect of Electromagnetic Stirring on Orientation Distribution Function of Primary Solid Phase of Al-Cu Alloy [ 421 K ]
Authors: Dock Young Lee, Jun Hyun Han, Suk Won Kang, Jung-Hwa Mun, Ki Bae Kim
p530 Cell Sensing Margin of Lead-Free (Bi,La)₄Ti₃O₁₂Thin Film Deposited on MTP Cell Structure in High Density FeRAM Device [ 534 K ]
Authors: J.H. Choi, H.S. Yoo, K.W. Cho, N.K. Kim, S.H. Oh, E.S. Choi, S.J. Yeom, H.J. Sun, S.S. Lee, K.N. Lee, Suk Kyoung Hong, Tae Whan Hong, Il Ho Kim, Sung Lim Ryu, Soon Young Kweon
p534 Hydrogen Absorption Kinetics of Ti-Nb-Cr Alloys [ 552 K ]
Authors: Kyung Shin, Song Seok, Soon Young Kweon, Il Ho Kim, Young Geun Lee, Tae Whan Hong
p538 Effects of La₂O₃ on the Piezoelectric Properties of Lead-Free (Bi_0.5Na_0.5)_0.94Ba_0.06TiO₃ Piezoelectric Ceramics [ 3 M ]
Authors: Y.-J. Son, Y.G. Choi, Joon Chul Kwon, K.W. Cho, Young Moon Kim, Soon Young Kweon, Tae Whan Hong, Young Geun Lee, Sung Lim Ryu, Man Soon Yoon, Soon Chul Ur
p542 Quantitative Analysis of Micro-Macro Domain Transition of PNN-PT-PZ(x) System at Higher PZ Content [ 2 M ]
Authors: Man Soon Yoon, Soon Chul Ur
p546 Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength [ 353 K ]
Authors: Jong Woong Kim, Seung Boo Jung
p550 Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps [ 346 K ]
Authors: Dae Gon Kim, Sang Su Ha, Seung Boo Jung
p554 TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate [ 551 K ]
Authors: Jeong Won Yoon, Seung Boo Jung
p558 Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock [ 322 K ]
Authors: Bo In Noh, Seung Boo Jung

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