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Study on Nanometric Machining Process of Monocrystalline Si

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Abstract:

A three-dimensional model of molecular dynamics (MD) was employed to study the nanometric machining process of Si. The model included the utilization of the Morse potential function and the Tersoff potential function to simulate the interatomic force between atoms. By analysis of snapshots and local radial distribution function (RDF) during the various stages of the cutting process, amorphous phase transformation of chip and machined surface are observed, but no phase transformation of bulk. Chip volume change is observed due to the amorphous phase transformation. Dislocations around the tool and elastic recovery of the machined surface do not appear. The effects of surface adsorption on machined surface state have been studied on the basis of surface energy and surfaces hardness. Surface energy decreases and hardness increases by adsorption. Oxygen atoms adsorbed are on the machined surface and subsurface region.

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Advances in Machining & Manufacturing Technology VIII View Preview

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Periodical:

Key Engineering Materials (Volumes 315-316)

Pages:

792-795

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.315-316.792

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Online since:

July 2006

Authors:

Yu Lan Tang, Ying Chun Liang, D.X. Wang, J.W. Zhao

Keywords:

Adsorption, Molecular Dynamic Simulation, Radial Distribution Function (RDF)

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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