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KEM - Authors (Earmme, Y.Y.)

ISSN: 1013-9826

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• p227 Measurement of Mechanical Properties and Residual Stresses of Bridged Gold Films and Circular Gold Membranes
  Authors: Woo Sung Choi, S.T. Choi, Sang Uk Son, Seung Seob Lee, S.Y. Yang, Y.Y. Earmme
• p397 Discontinuity of Stress Intensity Factor for Kinked Interfacial Crack under Anti-Plane Shear
  Authors: K.S. Lee, S.R. Choi, Y.Y. Earmme
• p403 Thermoelastic Analysis of an Interfacial Crack in Bimaterial
  Authors: T.W. Kim, S. Im, Y.Y. Earmme
• p567 An Application of Conservation Integrals to Elastic T-Stresses of Interface Crack
  Authors: H.J. Moon, Y.Y. Earmme
• p1123 A Thermomechanical Analysis of MCM-D Substrate of Polymer and Metal Multilayer
  Authors: Ji Ho Lim, Ji Soon Kim, Kyoung Wook Paik, Y.Y. Earmme
• p23 Anisotropic and Isotropic Elasticity, and its Equivalence for Singularity, Interface and Crack in Bimaterials and Trimaterials
  Authors: Y.Y. Earmme, S.T. Choi, H. Shin
• p1337 Strength Design and Minimization of Residual Stresses in Reversible GaAs Wafer Bonding Process
  Authors: S.T. Choi, Jun Yeob Song, Jae Hyun Kim, S. Lee, Y.Y. Earmme