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KEM - Keywords (Wafer Level Packaging)

ISSN: 1013-9826

• KEM - Home
• KEM - Keyword Index
• KEM - Author Index
• KEM - Editorial Board

• p231 Experimental Studies of Through-Wafer Copper Interconnect in Wafer Level MEMS Packaging
  Authors: Sung Hoon Choa
• p609 Reliability of Hermetic RF MEMS Wafer Level Packaging Using Au-Sn Eutectic Bonding
  Authors: Qian Wang, Sung Hoon Choa, Woon Bae Kim, Jun Sik Hwang, Suk Jin Ham, Chang Youl Moon
• p617 Wafer Level Hermetic Packaging for RF-MEMS Devices Using Electroplated Gold Layers
  Authors: Gil Soo Park, Ji Hyuk Yu, Sang Won Seo, Woo Beom Choi, Kyeong Kap Paek, Man Young Sung, Heung Woo Park, Sang Kyeong Yun, Byeong Kwon Ju