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Ultra Clean Processing of Silicon Surfaces

Solid State Phenomena Volumes 65 - 66

• Papers
• Abstracts

• p173 Relation between Oxide-CMP Induced Defects and Post-CMP Cleaning Strategies   [ 179 K ]
  Authors: K. Devriendt, E. Vrancken, N. Heylen, J. Grillaert, Marc Meuris, Marc M. Heyns, Z.C. Lin
• p177 Evaluation of Post Metal Etch Cleaning by Analyzing the Chemical Compositions and Distributions on the Etched Al Surface   [ 232 K ]
  Authors: Hua Ling Li, Mikhail R. Baklanov, Werner Boullart, Thierry Conard, B. Brijs, W. Vandervorst, Karen Maex, Ludo Froyen
• p181 New Methods for Contamination Control and Dry Cleaning of Silicon Wafers   [ 59 K ]
  Authors: G.S. Selwyn
• p183 Wafer Backside Cleaning by Twin-Fluid Flow Cleaning   [ 205 K ]
  Authors: Y. Tatehaba, Kazuo Kitagawa, Kunio Shimada, E. Ando
• p187 Evaluation of a Dry Laser Cleaning Process for the Removal of Surface Particles   [ 249 K ]
  Authors: Guy Vereecke, Erika Röhr, Marc M. Heyns
• p191 Dependency of Micro Particle Adhesion of Dispersive and Nondispersive Interactions Analyzed by Atomic Force Microscopy   [ 200 K ]
  Authors: A. Kawai, Kunio Shimada, E. Andoh
• p195 Integrated Cleaning: Application of Densified Fluid Cleaning (DFC) to Post-Etch Residue Removal   [ 306 K ]
  Authors: V. Starov, D. Beery, Alex Kabansky
• p199 Application of Microcalorimeter EDS X-Ray Detectors to Particle Analysis   [ 200 K ]
  Authors: Alain C. Diebold, D.A. Wollman, G.C. Hilton, K.D. Irwin, J.M. Martinis, Benjamin Y.H. Liu
• p203 Surface Characterization in the Silicon Cleaning Process by a-UPC; Atmospheric Ultraviolet Photoelectron Counting   [ 162 K ]
  Authors: Y. Kôzuki, Y. Nakajima, T. Sato, Kei Kinoshita, T. Tsunoda
• p207 Microscopic Analysis of Particle Removal by Gas/Liquid Mixture High-Speed Flow   [ 152 K ]
  Authors: N. Hirano, K. Takayama, J. Falcovitz, T. Kataoka, Kunio Shimada, E. Ando