Ultra Clean Processing of Silicon Surfaces
Solid State Phenomena Volumes 76 - 77
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p169
Controlling Silicon Surface Roughness During Photochemical Cleaning
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155 K
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Authors: Jeffery W. Butterbaugh, Brent Schwab, Thomas Sorsch, Martin L. Green -
p173
Influence of Cleaning on the Quality of the Bonding Interface in Direct Bonded Silicon Wafers
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249 K
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Authors: W.A. Nevin, D.L. Gay, G. O'Neill -
p177
Characterization and Production Metrology of Thin Transistor Gate Dielectric Films
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188 K
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Authors: William Chism, Alain C. Diebold, Jesse Canterbury, Curt Richter -
p181
Electronic Properties of Wet-Chemically Prepared Oxide Layers
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227 K
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Authors: H. Angermann, W. Henrion, M. Rebien -
p185
A Probe of Chemical Oxide Growth Conditions
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199 K
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Authors: Larry W. Shive, Claire Frey, Carissima Vitus -
p189
Fundamentals of Wafer Rinse Processes and the Interactions with Water Conservation and Recycling in Semiconductor Manufacturing Plants
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101 K
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Authors: F. Shadman, D. Seif, T. Peterson -
p191
A Novel Rinsing Tank Concept to Save DI Water Using an Internal Recirculation Flow: 'Circle Stream Rinser'
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233 K
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Authors: F. Tardif, F. de Bourmont, T. Vareine, V. Oravec, A. Di Martino -
p195
Rinsing and Drying Effects on Heterogeneous Substrates
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277 K
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Authors: Wim Fyen, Rita Vos, K. Devriendt, Marc Meuris, Paul W. Mertens, Marc M. Heyns -
p199
Low Consumption Front End of the Line Cleaning: LC-FEOL
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278 K
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Authors: Pascal Besson, C. Cowache, J.M. Fabbri, F. Tardif, Alessio Beverina -
p203
New Single Wafer Double Sided Spin Cleaning Method
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246 K
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Authors: Walter Starflinger, Reinhard Sellmer, Stefan Detterbeck, Alfred Lechner, Jörg Leberzammer, Hans-Jürgen Kruwinus
