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Ultra Clean Processing of Silicon Surfaces VII

Solid State Phenomena Volumes 103 - 104

• Papers
• Abstracts

• p45 In Situ Wafer Processing for Next Generation Devices   [ 273 K ]
  Authors: Ismail Kashkoush, Lewis Liu, Nick Yialamas, R. Novak
• p49 Organic Contamination Control in Silicon Surface Processing   [ 90 K ]
  Authors: Koichiro Saga, Takeshi Hattori
• p55 Application of UV/VIS-Spectroscopy for Determination of Complexing Agent Stability in APM and Like Mixtures Thereof   [ 165 K ]
  Authors: O. Doll, B.O. Kolbesen
• p59 Plasma Cleaning for W Polymetal Gate   [ 439 K ]
  Authors: Alex Kabansky, Harry Lee
• p63 Development of New Batch-Type Plasma Assisted NOR (Native-Oxide-Removal) Dry Cleaning Equipment   [ 16 M ]
  Authors: Wan Sik Kim, Wan Goo Hwang, Il-Kyoung Kim, Ki-Young Yun, Kwang Myung Lee, Seung Ki Chae
• p67 Evaluation of Wafer Drying Methods for GIGA-LEVEL Device Fabrication   [ 473 K ]
  Authors: Gyu Hyun Kim, Geun Min Choi, Young Wook Song
• p71 Surfactionated Rinse against Pattern Collapse and Defectivity in 193nm Lithography   [ 219 K ]
  Authors: S.I. Misat, G.G. Grozev, J.J. Versluijs
• p75 Performance of a Linear Single Wafer IPA Vapour Based Drying System   [ 256 K ]
  Authors: Wim Fyen, Sophia Arnauts, Frank Holsteyns, G. Doumen, Guy Vereecke, Jan Van Steenbergen, Paul W. Mertens
• p79 Effective Rinse Aiming at Water-Mark-Free Drying for Single-Spin Wet Cleaning Process   [ 87 K ]
  Authors: Katsuhiko Miya, Takuya Kishimoto, Akira Izumi
• p83 Insights into Watermark Formation and Control   [ 82 K ]
  Authors: Hiromitsu Namba, Takehiko Orii, Hiroki Ohno, Glenn W. Gale