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Ultra Clean Processing of Silicon Surfaces VII

Solid State Phenomena Volumes 103 - 104

• Papers
• Abstracts

• p181 Non-Damaging Particle Removal Using Cryogenic Aerosols   [ 16 M ]
  Authors: Thomas J. Wagener, James F. Weygand, Gregory P. Thomes
• p185 Laser Cleaning of Particles from Silicon Wafers: Capabilities and Mechanisms   [ 334 K ]
  Authors: Johannes Graf, F. Lang, M. Mosbacher, P. Leiderer
• p189 Contaminants Removal from Epi Substrates Using Vapor-Laser Process   [ 16 M ]
  Authors: A. Wachs, S. Zeid, Y. Uziel, W. Huber, J. Krueger
• p193 Chemical Additive Formulations for Particle Removal in SCCO₂-Based Cleaning   [ 362 K ]
  Authors: M.B. Korzenski, D.D. Bernhard, T.H. Baum, Koichiro Saga, Hitoshi Kuniyasu, Takeshi Hattori
• p199 Non-Damaging CO₂ Aerosol Cleaning in FEOL IC Manufacturing   [ 16 M ]
  Authors: Souvik Banerjee, Andrea Campbell
• p203 Particle Adhesion on Tool Kit Part: Case Study for Ceramic Material   [ 402 K ]
  Authors: S. Blanc, B. Préauchat, Marc Veillerot
• p209 Simultaneous Analysis of Light and Heavy Organic Contamination on Silicon Wafer   [ 164 K ]
  Authors: Heini Ritala, Simo Eränen, Arto Kiviranta, Jaakko Räsänen, Virpi Tarkiainen, Jari Kiuru, Raimo A. Ketola
• p213 VPD-DC-TXRF for Metallic Contamination Analysis of Ge Wafers   [ 78 K ]
  Authors: David Hellin, V. Geens, I. Teerlinck, Jan Van Steenbergen, Jens Rip, W. Laureyn, G. Raskin, Paul W. Mertens, Stefan De Gendt, Chris Vinckier
• p217 Cu Spin Cleaning Evaluation by SOR X-Ray Fluorescence Analysis   [ 250 K ]
  Authors: Hidekazu Hayashi, Ken Tsugane, Yasushi Kagoshima, Takahisa Koyama, Masaharu Watanabe, Yasushi Kozuki
• p221 Application of HPLC for the Analysis of Organic Additives in Cleaning Chemicals and Cleaning Mixtures   [ 89 K ]
  Authors: S. Metzger, B.O. Kolbesen