Ultra Clean Processing of Silicon Surfaces VII
Solid State Phenomena Volumes 103 - 104
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p275
Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP
[
451 K
]
Authors: Yi Koan Hong, Ja Hyung Han, Jin Hyung Lee, Jin Goo Park, Ahmed A. Busnaina -
p279
A Force Study in Brush Scrubbing
[
16 M
]
Authors: Kai Dong Xu, Rita Vos, Guy Vereecke, G. Doumen, Wim Fyen, Paul W. Mertens, Marc M. Heyns, Chris Vinckier, Jan Fransaer -
p283
Dissolution Characteristics of Ceria in Ascorbic Acid Solutions with Implications to Cleaning
[
16 M
]
Authors: S. Tamilmani, V. Lowalekar, Srini Raghavan, R. Small -
p287
Investigation of Dissolution and Electrodeposition of Copper in Concentrated and Diluted Oxalic Acid Media in Post-CMP Cleaning
[
262 K
]
Authors: C. Gabrielli, C. Mace, J. Matha, S. Mège, E. Ostermann, H. Perrot -
p291
Non-Contact Cleaning Process for Post-CMP Copper
[
161 K
]
Authors: Daniel A. Koos, Julia Svirchevski, Daniel J. Vitkavage, David G. Hansen, Karen A. Reinhardt, Frank Huang, Marie Mitchel, Guang Ying Zhang -
p297
Novel Photo Resist Stripping for Single Wafer Process
[
121 K
]
Authors: Atsushi Okuyama, Kazumi Asada, Hitoshi Abe, Hayato Iwamoto, Yoshio Okamoto, Takuya Wada -
p301
Resist Stripping for Advanced FEOL Nodes: Improvements to Process Based on Ozone Diffusion by Use of Additives
[
628 K
]
Authors: Olivier Louveau, Emile Lajoinie, Olivier Pollet, Jean Philippe Odet, Sylviane Cêtre, Laurent Lachal, Béatrice Icard, Evelyne Tabouret, Marc Veillerot, Hervé Fontaine, Didier Louis -
p305
Cleaning Capability of High Concentration Ozonated Water
[
1 M
]
Authors: Teruo Haibara, Kenichi Uemura, Takio Adachi -
p309
Photoresist Stripping by Ozone/Water Processes: Effect of Additives
[
72 K
]
Authors: H. Vankerckhoven, F. De Smedt, K. Vandersmissen, M. Claes, Stefan De Gendt, Marc M. Heyns, Chris Vinckier -
p315
Supercritical CO2 Applications in BEOL Cleaning
[
645 K
]
Authors: P.D. Matz, R.F. Reidy
