HOME CONTACT

Username: Password:

> @scientific.net

Ultra Clean Processing of Silicon Surfaces VII

Solid State Phenomena Volumes 103 - 104

• Papers
• Abstracts

• p323 Repair of Porous MSQ (p-MSQ) Films Using Monochlorosilanes Dissolved in Supercritical CO₂   [ 214 K ]
  Authors: Bo Xie, Anthony Muscat
• p327 Copper Decontamination Ability of Supercritical-CO₂/Additives on CVD and Spin-On Porous MSQ Materials   [ 16 M ]
  Authors: J. Daviot, V. Perrut, F. Gaillard, C. Millet, Adrien Danel, Lucile Broussous, Didier Louis
• p331 Angled XPS Analysis of Low-k Dielectric Surfaces after Cleaning   [ 20 M ]
  Authors: Y.S. Tan, Simon Y.M. Chooi, Chian-Yuh Sin, Ping-Yu Ee, M.P. Srinivasan, Simo Olavi Pehkonen
• p337 Impact of Downstream Ash Plasmas on Ultra Low-k Materials   [ 550 K ]
  Authors: Nicolas Possémé, Thibaut David, P. Meininger, O. Louveau, T. Chevolleau, O. Joubert, Didier Louis
• p341 Activated He:H₂ Strip of Photoresist over Porous Low-k Materials   [ 117 K ]
  Authors: Qing Yuan Han, Brian White, Ivan L. Berry, C. Waldfried, O. Escorcia
• p345 Qualification of Resist Strip Process for Ultra Low-k/Cu Interconnect   [ 354 K ]
  Authors: Han Xu, Amy Shen, Vlad Tarasov, Brian White, Josh Wolf
• p349 Effect of Chemical Solution on the Stability of Low-k Films   [ 168 K ]
  Authors: E. Kesters, Q.T. Le, Mikhail R. Baklanov, Werner Boullart, Paul W. Mertens
• p353 Aqueous Based Single Wafer Cu/Low-k Cleaning Process Characterization and Integration into Dual Damascene Process Flow   [ 792 K ]
  Authors: Jian She Tang, Brian J. Brown, Steven Verhaverbeke, Han Wen Chen, Jim Papanu, Raymond Hung, Cathy Cai, Dennis Yost
• p357 Via Cleaning Technology for Post Etch Residues   [ 505 K ]
  Authors: B.G. Sharma, Chris Prindle
• p361 Barrier and Copper Seedlayer Wet Etching   [ 1 M ]
  Authors: Claire Therese Richard, M.M. Frank, Pascal Besson, E. Serret, N. Hotellier, Alessio Beverina, L. Dumas, Lucile Broussous, F. Kovacs, Thierry Billon