HOME CONTACT

Username: Password:

> @scientific.net

Ultra Clean Processing of Silicon Surfaces VII

Solid State Phenomena Volumes 103 - 104

• Papers
• Abstracts

• p365 Deposition Behavior of Volatile Acidic Contaminants on Metallic Interconnect Surfaces   [ 189 K ]
  Authors: Hervé Fontaine, Marc Veillerot, Adrien Danel
• p369 Effects of Patterns on Corrosion in Cu CMP   [ 291 K ]
  Authors: Ja Hyung Han, Ja Eung Koo, Duk Ho Hong, Byung Lyul Park, Seong Il Kim, In-Soo Cho, Dae Hong Eom, Jin Goo Park, Ahmed A. Busnaina
• p373 Advanced Aqueous Cleaner II: PER Removal from Sensitive Cu/Low-k Devices   [ 561 K ]
  Authors: Chris Reid, Jerome Daviot, Douglas Holmes
• p377 Advanced Aqueous Cleaner I, Dilute Solutions for the Selective Removal of Post Etch Residues in the Presence of Aluminium   [ 343 K ]
  Authors: J. Daviot, C. Reid, Douglas Holmes
• p381 New Post Etch Polymer Removal Process for Al-Interconnects and Vias in Tank and Spray Tools Using a New Inorganic Chemistry   [ 1 M ]
  Authors: Raimund Mellies, Stefan Kunz, Franz Nilius, Dieter Mayer, Andreas Kühner
• p385 Effective Polymer Removal: Process Window-Process Uniformity-Extended Chemical Bath-Life   [ 139 K ]
  Authors: Chuan Yew-Leong, Wee Boon-Lim, Wayne A-Cady, Nik A-Mustapha, Kah Keen-Lai