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The Hybrid Pixel Sensors and Read-Out Electronics

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Abstract:

Hybrid pixel sensors (detectors) have shown to be a valid alternative to other types of Xray imaging devices due to their high sensitivity, linear behavior and wide dynamic range, and low noise. One important feature of these devices is the fact that detectors and readout electronics are manufactured separately. The charge created by the interaction of X-ray photons in the sensor is very small and has to be amplified in a low-noise circuit before any further signal processing. The signal induced on the electrodes of the sensor is transferred to the readout chip, where it is integrated in a charge sensitive amplifier. The issue reviews on physical principles of operation and design of the hybrid pixel sensors developed on the basis of the silicon CMOS and GaAs MESFETtechnologies. The authors have designed GaAs charge sensitive amplifiers for hybrid pixel detectors and show the results of a simulation.

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Periodical:

Solid State Phenomena (Volume 113)

Pages:

453-458

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.113.453

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Online since:

June 2006

Authors:

R. Navickas, V. Barzdenas

Keywords:

Charge Sensitive Amplifier (CSA), Flip-Chip Method, Hybrid Pixel Sensors, Readout Integrated Circuit (ROIC), X-Ray

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© 2006 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] M. G. Bisogni, P. Delogu, M. E. Fantacci et al: IEEE Trans on Nucl. Sci., vol. 51(5) (2004), pp.3081-3085.

Google Scholar

[2] S. R. Amendolia, E. Bertolucci, M. G. Bisogni et al: Nucl. Instr. and Meth. Vol. A 422 (1999), pp.201-205.

Google Scholar

[3] C. Schwarz, M. Campbell, R. Goeppert et al: Nucl. Phys. Proc. Suppl. Vol. 78 (1999), p.491496.

Google Scholar

[4] X. Lopart, M. Campbell, R. Dinapoli, D. SanSegundo E. Pernigotti: IEEE Trans. Nucl. Sci., vol. 49(5) (2002), pp.2279-2283.

Google Scholar

[5] M. Campbell, E. H. M. Heijne, G. Meddeler, E. Pernigotti and W. Snoeys: IEEE Trans. Nucl. Sci. Vol. 45 (3), (1998), pp.751-753.

DOI: 10.1109/23.682629

Google Scholar

[6] L. Rossi: Nucl. Instr. and Meth. Vol. A501 (2003), pp.239-244.

Google Scholar

[7] M. Lozano, E. Cabruja, A. Collado et al: Nucl. Instr and Meth. Vol. A, 473 (2001), pp.95-101.

Google Scholar

[8] P. F. Manfredri, M. Manghisoni: Nucl. Instr. and Meth. Vol. A, 465 (2001), pp.140-147.

Google Scholar

[9] R. Navickas, V. Barzdenas: Electronics and Electrical Eng. Kaunas, Technologija (2005), Nr. 6 (62), pp.47-51 (in Lithuanian).

Google Scholar

[10] R. Navickas, V. Morozov: Information Technology and Control Kaunas, Technologija No 1 (14), (2000), pp.60-64.

Google Scholar

[11] R. Navickas, V. Morozov: Electronics and Electrical Eng. Kaunas, Technologija No 1 (19) (1999), pp.16-19 (in Lithuanian).

Google Scholar