Aging Precipitation Behavior of Cu-Ag-Cr Alloy

Article Preview

Abstract:

The Cu-Ag-Cr alloy is a kind of aging hardening copper alloy and has excellent combination properties of high strength and good electrical and thermal conductivity. In the present investigation, the aging precipitation behavior of Cu-Ag-Cr alloy is studied, and the effects of aging processes on the microstructure and properties are discussed. Emphasis is on the correlation between the coherency and coarsening behavior of the Cr precipitates. When the alloy aging at low annealing temperatures, the homogeneous dispersed Cr precipitates are observed to be approximately spherical and keep coherent with Cu matrix in the Cu-Ag-Cr alloy, the coherency is lost between at 450°C~520°C, coherency on coarsening process of Cr precipitates at high annealing temperatures, the radium for coherent / semi-coherent transition of the Cr precipitates is determined from TEM micrographs as 15-45nm. Aging in the intermediate stage, coherent and semi-coherent particles can co-exist(15

You might also be interested in these eBooks

Info:

Periodical:

Solid State Phenomena (Volume 118)

Pages:

41-46

Citation:

Online since:

December 2006

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2006 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] S.G. Jia, P. Liu, F.Z. Ren, et al., Metals and materials international. 11, (2005)71.

Google Scholar

[2] Da Hai He and Rafael R. Manory. Wear, 215, (1998)146.

Google Scholar

[3] Juanhua SU, Qingming DONG, Ping LIU. J. Mater. Sci. Technol. 19, (2003)529.

Google Scholar

[4] Dong Qi-ming, Su Juan-hua, Liu Ping. Trans. Mater. Heat Treatment. 25, (2004)157.

Google Scholar

[5] M. Merola, A. Orsini, E. Visca. Journal of Nuclear Materials. 307, (2002)677.

Google Scholar

[6] Liu Ping, Kang Bu-xi, Cao Xing-guo, et al., Trans. Nonferrous Met. Soc. China. 9, (1999)723.

Google Scholar

[7] M.J. Jones, F.J. Humphreys. Acta. Mater. 51, (2003) 2149.

Google Scholar

[8] R. Higginson, P. Bate. Acta. mater. 47, (1999)1079.

Google Scholar

[9] C. P. CHANG, P. L. SUN, P. W. KAO. Acta. mater. 48, (2000)3377.

Google Scholar

[10] Y. HARADA, D. C. DUNAND. Acta. mater. 48, (2000)3477.

Google Scholar

[11] E. A. Marquis, D. N. Seidman. Acta. mater. 49, (2001)(1909).

Google Scholar

[12] Emmanuelle A. Marquis, David N. Seidman and David C. Dunand. Acta. Mater. 51, (2003) 4752.

Google Scholar

[13] Gabriel M. Novotny, Alan J. Ardell. Mater. Sci. Engin. A318, (2001)144.

Google Scholar

[14] S. Iwamura, Y. Miura. Acta. Mater. 52, (2004)591.

Google Scholar

[15] LEI Jing-guo, HUANG Jin-liang, LIU Ping. Journal of Wuhan University of Technology. 20, (2005)21.

Google Scholar

[16] P Liu, B.X. Kang. Mater. Sci. Engin. A265, (1999)262.

Google Scholar