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Ultra Clean Processing of Semiconductor Surfaces VIII

Solid State Phenomena Volume 134

• Papers
• Abstracts

• p45 Surface Microroughness of Silicon in Wet Process and its Minimization   [ 341 K ]
  Authors: Hitoshi Morinaga, Kenji Shimaoka, Tadahiro Ohmi
• p49 Oxidation of Si Surface Utilizing SCCO₂   [ 170 K ]
  Authors: K. Saito, T. Kitajima, M. Kohno, I. Mizobata, T. Iwata, S. Hirae
• p53 Single-Wafer Wet Chemical Oxide Formation for Pre-ALD High-k Deposition on 300 mm Wafer   [ 1 M ]
  Authors: K. Sano, Akira Izumi, Atsuro Eitoku, J. Snow, L. Nyns, S. Kubicek, R. Singanamalla, O. Richard, Thierry Conard, Rita Vos, Paul W. Mertens
• p57 Effect of SC-1 Treatment in Thermal Wall Oxide on Nanoscale STI Gap-Filling by O₃/TEOS CVD   [ 266 K ]
  Authors: Seung Cheol Lee, Choon Kun Ryu, Sang Wook Park, Gyu An Jin, Sang Deok Kim, Ki Hong Yang, Sang Hyon Kwak, Su Hyun Lim, Young Jun Kim, Sun Mi Park, Chul Sik Jang, Sung Ki Park
• p63 Etch Rate Profile Characterization of High-κ Materials   [ 1 M ]
  Authors: Annamaria Votta, Enrico Bellandi, Rosella Piagge, Massimo Caniatti, Francesco Pipia, Mauro Alessandri
• p67 Critical Thickness Threshold in HfO₂ Layers   [ 1 M ]
  Authors: Pascal Besson, Virginie Loup, Thierry Salvetat, Névine Rochat, Sandrine Lhostis, Sylvie Favier, Karen Dabertrand, Vincent Cosnier
• p71 Surface Preparation Challenge on Nitrided Gate Oxides   [ 531 K ]
  Authors: Philippe Garnier, David Barge, Jerome Bienacel, Brice Tavel, Nicolas Cabuil, Didier Lévy, Kathy Barla
• p75 Development of a New TaN Etchant for Metal Gate   [ 184 K ]
  Authors: Mong Sup Lee, Sang Yong Kim, Ji Hoon Cha, Jeong Nam Han, Im Soo Park, Kun Tack Lee, Chang Ki Hong, Han Ku Cho, Joo Tae Moon
• p79 Peracetic Acid as Active Species in Mixtures for Selective Etching of SiGe/Si Layer Systems – Aspects of Chemistry and Analytics   [ 154 K ]
  Authors: Mathias Guder, B.O. Kolbesen, Cécile Delattre, C. Fischer, H. Schier, Gerald Wagner
• p83 A Wet Etching Technique to Reveal Threading Dislocations in Thin Germanium Layers   [ 309 K ]
  Authors: Laurent Souriau, V. Terzieva, Marc Meuris, M. Caymax